Author's Latest Posts


3D NAND Needs 3D Metrology


By Nick Keller and Andy Antonelli You’ve read the reports: the memory market is floundering as the semiconductor industry moves through another scarcity/surplus cycle. Be that as it may, innovation is happening as the industry continues to pursue increasingly higher three-dimensional stacks, with 3D NAND stacks taller than 200 layers entering production. However, there are challenges... » read more

Critical Moves: Advanced Logic Devices And CIS Benefit From Applications Using IRCD Metrology


As 3D NAND continues to scale vertically — all in the name of increasing capacity and speed and reducing inefficiency and cost — maintaining channel hole critical dimension (CD) and shape uniformity becomes even more challenging. Faced with rising high-aspect ratios, addressing these challenges requires new inline non-destructive metrology to provide real-time process control. Infrared crit... » read more