Author's Latest Posts

KAN: Kolmogorov Arnold Networks: An Alternative To MLPs (MIT, CalTech, et al.)
By Technical Paper Link - 13 Jun, 2024 - Comments: 0

A new technical paper titled "KAN: Kolmogorov-Arnold Networks" was published by researchers at MIT, CalTech, Northeastern University and The NSF Institute for Artificial Intelligence and Fundamental Interactions. Abstract: "Inspired by the Kolmogorov-Arnold representation theorem, we propose Kolmogorov-Arnold Networks (KANs) as promising alternatives to Multi-Layer Perceptrons (MLPs). While... » read more

Probing Attacks Against Chiplets
By Technical Paper Link - 11 Jun, 2024 - Comments: 0

A technical paper titled “Evaluating Vulnerability of Chiplet-Based Systems to Contactless Probing Techniques” was published by researchers at University of Massachusetts and Worcester Polytechnic Institute. Abstract: "Driven by a need for ever increasing chip performance and inclusion of innovative features, a growing number of semiconductor companies are opting for all-inclusive System-... » read more

Characterizing and Evaluating A Quantum Processor Unit In A HPC Center
By Technical Paper Link - 10 Jun, 2024 - Comments: 0

A new technical paper titled "Calibration and Performance Evaluation of a Superconducting Quantum Processor in an HPC Center" was published by researchers at Leibniz Supercomputing Centre, IQM Quantum Computers, and Technical University of Munich. Abstract "As quantum computers mature, they migrate from laboratory environments to HPC centers. This movement enables large-scale deployments,... » read more

Device Characteristics of GAA-Structured CMOS and CTFET Under Varying Temperatures
By Technical Paper Link - 10 Jun, 2024 - Comments: 0

A new technical paper titled "Vertical-Stack Nanowire Structure of MOS Inverter and TFET Inverter in Low-temperature Application" was published by researchers at National Tsing Hua University and National United University in Taiwan. Abstract "Tunneling field effect transistors (TFET) have emerged as promising candidates for integrated circuits beyond conventional metal oxide semiconductor ... » read more

Efficient TNN Inference on RISC-V Processing Cores With Minimal HW Overhead
By Technical Paper Link - 10 Jun, 2024 - Comments: 0

A new technical paper titled "xTern: Energy-Efficient Ternary Neural Network Inference on RISC-V-Based Edge Systems" was published by researchers at ETH Zurich and Universita di Bologna. Abstract "Ternary neural networks (TNNs) offer a superior accuracy-energy trade-off compared to binary neural networks. However, until now, they have required specialized accelerators to realize their effic... » read more

Adoption of Chiplet Technology in the Automotive Industry
By Technical Paper Link - 10 Jun, 2024 - Comments: 0

A technical paper titled "Chiplets on Wheels: Review Paper on Holistic Chiplet Solutions for Autonomous Vehicles" was published by researchers at the Indian Institute of Technology, Madras. Abstract "On the advent of the slow death of Moore's law, the silicon industry is moving towards a new era of chiplets. The automotive industry is experiencing a profound transformation towards software-... » read more

Comparing Thermal Properties In Molybdenum Substrate To Si And Glass For A System-On-Foil Integration (RIT, Lux)
By Technical Paper Link - 31 May, 2024 - Comments: 0

A technical paper titled “Comparative Analysis of Thermal Properties in Molybdenum Substrate to Silicon and Glass for a System-on-Foil Integration” was published by researchers at Rochester Institute of Technology and Lux Semiconductors. Abstract: "Advanced electronics technology is moving towards smaller footprints and higher computational power. In order to achieve this, advanced packag... » read more

Using Formal Verification To Evaluate The HW Reliability Of A RISC-V Ibex Core In The Presence Of Soft Errors
By Technical Paper Link - 31 May, 2024 - Comments: 0

A technical paper titled “Using Formal Verification to Evaluate Single Event Upsets in a RISC-V Core” was published by researchers at University of Southampton. Abstract: "Reliability has been a major concern in embedded systems. Higher transistor density and lower voltage supply increase the vulnerability of embedded systems to soft errors. A Single Event Upset (SEU), which is also calle... » read more

CAM-Based CMOS Implementation Of Reference Frames For Neuromorphic Processors (Carnegie Mellon U.)
By Technical Paper Link - 31 May, 2024 - Comments: 0

A technical paper titled “NeRTCAM: CAM-Based CMOS Implementation of Reference Frames for Neuromorphic Processors” was published by researchers at Carnegie Mellon University. Abstract: "Neuromorphic architectures mimicking biological neural networks have been proposed as a much more efficient alternative to conventional von Neumann architectures for the exploding compute demands of AI work... » read more

Physics-Based Digital Twin of a Thermally Aged Flip-Chip Package (TU Delft, NXP)
By Technical Paper Link - 29 May, 2024 - Comments: 0

A technical paper titled “Modelling thermomechanical degradation of moulded electronic packages using physics-based digital twin” was published by researchers at Delft University of Technology and NXP Semiconductors. Abstract: "Semiconductor devices are commonly encapsulated with Epoxy-based Moulding Compounds (EMC) to form an electronic package. EMC typically occupies a large volume with... » read more

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