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Ready, Set, Go: Outrunning Moore’s Law With 3D-IC

By Anthony Mastroianni and Gordon Allan, Siemens EDA 3D ICs are an exciting and promising extension of heterogeneous advanced package technology into the third dimension. Although far from mainstream, 3D IC’s time is coming, as chiplet standardization efforts and supporting tool developments begin to make 3D IC practicable and profitable to more players – big and small – and products w... » read more