By Vamsi Velidandla, John Hauck, Zhuo Chen, Joshua Frederick, and Zhihui Jiao
The semiconductor industry is constantly marching toward thinner films and complex geometries with smaller dimensions, as well as newer materials. The number of chemical mechanical planarization (CMP) steps has increased and, with it, a greater need for within-wafer uniformity and wafer-to-wafer control of the thin...
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