Newsletters Archive - Page 33 of 66 - Semiconductor Engineering


Auto, Security & Pervasive Computing – 02/06/2020


Top Stories Uses, Limits And Questions For FPGAs In Autos Where it works, where it doesn't, and where the choices get fuzzy. Hardware Attack Surface Widening Cable Haunt follows Spectre, Meltdown and Foreshadow as potential threat spreads beyond a single device; AI adds new uncertainty. Bigger, Faster, More Diverse And Expensive Synopsys' CEO examines the fundamental shifts in design ... » read more

System Level Design – 01/30/2020


Top Stories Divided On System Partitioning How close can we get to automated system optimization from a software function? The target keeps moving, but the tools keep becoming more capable. Making Sure RISC-V Designs Work As Expected Open-source growth predictions are impressive, but the verification process can be harder than with commercial ISAs. Big Design, IP And End Market Shifts ... » read more

Manufacturing, Packaging & Materials – 01/23/2020


Special Report 5/3nm Wars Begin New transistors structures are on the horizon with new tools and processes, but there are lots of problems, too. Top Stories SiC Foundry Business Emerges Will a fabless approach work in the power semi market? Finding Defects In EUV Masks New litho technology is in production, but not everything is working perfectly yet. Blogs Editor In Chief Ed Sperlin... » read more

Low Power High Performance – 01/16/2020


Top Stories Analog: Avoid Or Embrace? Data converters are required whenever you move between the analog and digital domains, and they present both challenges and opportunities. Priorities Shift In IC Design AI, edge applications are driving design teams to find new ways to achieve the best performance per watt. Moore’s Law, Supply Chains And Security Big changes ahead, from design t... » read more

Test, Measurement & Analytics – 01/14/2020


Special Report Automakers Changing Tactics On Reliability Focus shifts to more data-centric approaches as chip content increases. Top Stories Making 3D Structures And Packages More Reliable Challenges and solutions for finding defects in new structures and multi-chip integration. Big Growth Areas: Connectivity, AI, Reliability Where the chip industry is heading this year, and where the... » read more

IoT, Security & Automotive – 01/09/2020


Top Stories Auto Industry Shifts Gears On Where Data Gets Processed How to manage massive amounts of data in real time still isn’t clear, but it can’t be done in the cloud. Security Risks In The Supply Chain Trojans, a dual supply chain and industry consolidation are creating new threats for chipmakers. Can Germany’s Auto Industry Keep Pace? New technology is challenging decades... » read more

System Level Design – 12/19/2019


Top Stories Crossed Wires On Domains How well understood are domain crossings, especially when it involves multiple domains? They require a combination of methodology and tools. Will Open-Source Processors Cause A Verification Shift? Tools and methodologies exist, but who will actually do the verification is unclear. What Worked, What Didn't In 2019 The year started out shaky, but EDA... » read more

Manufacturing, Packaging & Materials – 12/17/2019


Top Stories Finding Defects In IC Packages New inspection tools on the way, but there may still be holes in coverage. New Packaging Roadmap Heterogeneous Integration Roadmap addresses future packaging directions and gaps, simplifies definitions. What’s Next For High Bandwidth Memory Different approaches for breaking down the memory wall. Blogs Editor In Chief Ed Sperling points to... » read more

Low Power High Performance – 12/12/2019


Special Report Defining AI Performance What does performance mean when discussing artificial intelligence? Many minds are working the problem, but not yet in a unified manner. Top Stories Interdependencies Complicate IC Power Grid Design A number of technical challenges have come together to make power grid design one of the most challenging design issues today. A New Dawn For IP The I... » read more

Test, Measurement & Analytics – 12/10/2019


Top Stories The Growing Challenges Of 5G Reliability Rapid changes in next-gen wireless technology and standards are only adding to the complexity. Gaps Emerge In Test And Analytics Comparison data is required for understanding drift and AI changes, but that's not so simple. Testing In Context Gaining Ground Why simple pass/fail testing no longer works. Blogs Editor In Chief Ed Sper... » read more

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