category: Top Stories

category: IoT, Security & Automotive

Using Predictive Maintenance To Boost IC Manufacturing Efficiency
By Laura Peters - 14 May, 2024 - Comments: 0

Predicting exactly how and when a process tool is going to fail is a complex task, but it's getting a tad easier with the rollout of smart sensors, standard interfaces, and advanced data analytics. The potential benefits of predictive maintenance are enormous. Higher tool uptime correlates with greater fab efficiency and lower operating costs, so engineers are pursuing multiple routes to boo... » read more

The Future Of Fault Coverage In Chips
By Gregory Haley - 14 May, 2024 - Comments: 0

Heterogeneous integration and sophisticated packaging are making chips more difficult to test, necessitating more versatile and efficient testing methods to minimize the time and cost it takes for each test insertion. In the past, test costs typically were limited to about 2% of the total cost of a chip. That cost has been rising in recent years, and with chiplets, advanced packaging, and mo... » read more

Doing More At Functional Test
By Anne Meixner - 14 May, 2024 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss the increasing importance of functional test, especially in high-performance computing, with Klaus-Dieter Hilliges, V93000 platform extension manager at Advantest Europe; Robert Cavagnaro, fellow in the Design Engineering Group at Intel (responsible for manufacturing and test strategy of data center products); Nitza Basoco, tec... » read more

IC Test And Quality Requirements Drive New Collaboration
By Laura Peters - 09 Apr, 2024 - Comments: 0

Rapidly increasing chip and package complexity, coupled with an incessant demand for more reliability, has triggered a frenzy of alliances and working relationships that are starting to redefine how chips are tested and monitored. At the core of this shift is a growing recognition that no company can do everything, and that to work together will require much tighter integration of flows, met... » read more

Progress In Wafer And Package Level Defect Inspection
By Anne Meixner - 09 Apr, 2024 - Comments: 0

The technology to enable sampling and the need for more metrology and inspection data in a production setting have aligned just in time to address the semiconductor industry’s newest and most complex manufacturing processes. In both wafer and assembly manufacturing, engineering teams have long relied on imaging tools to measure critical features and to inspect for defects after specific pr... » read more

New Strategies For Interpreting Data Variability
By Gregory Haley - 09 Apr, 2024 - Comments: 0

Every measurement counts at the nanoscopic scale of modern semiconductor processes, but with each new process node the number of measurements and the need for accuracy escalate dramatically. Petabytes of new data are being generated and used in every aspect of the manufacturing process for informed decision-making, process optimization, and the continuous pursuit of quality and yield. Most f... » read more

DTCO/STCO Create Path For Faster Yield Ramps
By Laura Peters - 12 Mar, 2024 - Comments: 0

Higher density in planar SoCs and advanced packages, coupled with more complex interactions and dependencies between various components, are permitting systematic defects to escape traditional detection methods. These issues increasingly are not detected until the chips reach high-volume manufacturing, slowing the yield ramp and bumping up costs. To combat these problems, IDMs and systems co... » read more

AI/ML Challenges In Test and Metrology
By Gregory Haley - 12 Mar, 2024 - Comments: 0

The integration of artificial intelligence and machine learning (AI/ML) into semiconductor test and metrology is redefining the landscape for chip fabrication, which will be essential at advanced nodes and in increasingly dense advanced packages. Fabs today are inundated by vast amounts of data collected across multiple manufacturing processes, and AI/ML solutions are viewed as essential for... » read more

Strategies For Detecting Sources Of Silent Data Corruption
By Anne Meixner - 12 Mar, 2024 - Comments: 0

Engineering teams are wrestling with how to identify the root causes of silent data corruption (SDC) in a timely and cost-effective way, but the solutions are turning out to be broader and more complex than simply fixing a single defect. This is particularly vexing for data center reliability, accessibility and serviceability (RAS) engineering teams, because even the best tools and methodolo... » read more

Adaptive Test Ramps For Data Intelligence Era
By Laura Peters - 08 Feb, 2024 - Comments: 0

Widely available and nearly unlimited compute resources, coupled with the availability of sophisticated algorithms, are opening the door to adaptive testing. But the speed at which this testing approach is adopted will continue to vary due to persistent concerns about data sharing and the potential for IP theft and data leakage. Adaptive testing is all about making timely changes to a test p... » read more

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