January 2016 - Page 6 of 10 - Semiconductor Engineering

Micro-Architectural Exploration for Low Power Design
By Abhishek Ranjan - 14 Jan, 2016 - Comments: 0

In the first part of this series, we had discussed the need to perform power optimizations and exploration at higher levels of abstractions where the potential to reduce the power consumption is highest. We presented the need for making coarser changes at higher level of abstractions to exploit full power saving potential. In the second part, we discussed some very potent micro-architectural te... » read more

Advanced Packaging Is Real. Now What?
By Ed Sperling - 14 Jan, 2016 - Comments: 0

For the past five years, it's been clear that 2.5D, fan-outs and other forms of system-in-package were on the horizon. Exactly when they would arrive no one knew. The most common prediction was that the timing would depend on when one of the big chipmakers decided to go down that route. The theory was that the remainder of the industry would follow, ecosystem issues would be sorted out—partic... » read more

Thinking Outside The Chip
By Ed Sperling - 14 Jan, 2016 - Comments: 0

Intel will begin adding 2.5D and 3D packaging into its processors, following the lead set by IBM and AMD in recognizing that new packaging approaches are essential for improving performance and lowering power. This shift won't derail the semiconductor industry's efforts to the reach future process nodes or continually shrink features, but it does add context for other factors that in... » read more

More Uses For Hypervisors
By Ann Mutschler - 14 Jan, 2016 - Comments: 0

Hypervisors are showing up in more places than ever before as a quick and inexpensive way to utilize multiple cores and multiple chips more effectively and more securely. This marks an interesting twist for a technology that originally was developed as a way of enabling virtualization on a PC, allowing users to run multiple incompatible applications on the same computer. That was followed in... » read more

Predictions For 2016: Markets
By Brian Bailey - 14 Jan, 2016 - Comments: 0

Seventeen companies sent in their predictions for this year with some of them sending predictions from several people. This is in addition to the CEO predictions that were recently published. That is a fine crop of views for the coming year, especially since they know that they will be held accountable for their views and this year, just like the last, they will have to answer for them. We beli... » read more

Shifting Performance Bottlenecks Driving Change In Chip And System Architectures
By Steven Woo - 14 Jan, 2016 - Comments: 0

The rise of personal computing in the 1980s — along with graphical user interfaces (GUIs) and applications ranging from office apps to databases — drove the demand for faster chips capable of removing processing bottlenecks and delivering a more responsive end-user experience. Indeed, the semiconductor industry has certainly come quite a long way since IBM launched its PC way back in 1981. ... » read more

2026: I Can Only Imagine…
By Mike Thompson - 14 Jan, 2016 - Comments: 0

It was fun to see all of the new products that were rolled out this year at CES. It got me thinking about how much technology has advanced in the past 10 years. In 2006, the iPhone was still a year away from being introduced and we hadn’t discovered tablets yet. The Internet wasn’t mobile and the cloud was still something in the sky. Never mind Fitbits, smart watches, augmented reality or a... » read more

One On One: John Lee
By Ed Sperling - 14 Jan, 2016 - Comments: 0

John Lee, general manager and vice president of Ansys—and the former CEO of data analytics firm Gear Design Solutions, which Ansys acquired in September—sat down with Semiconductor Engineering to talk about how big data techniques can be used in semiconductor and system design. What follows are excerpts of that conversation. SE: What's your goal now that Gear has been acquired by [getent... » read more

Solving ‘Simulator Sickness’ With Smart Software, SoC Design
By Brian Fuller - 14 Jan, 2016 - Comments: 0

The growth in virtual and augmented reality headsets is expected to explode in the coming years. The U.K.-based research firm KZero estimates headset unit volume will jump from nearly 4 million this year to 38.4 million in 2018. But that growth rate might be stunted if users continue to struggle with “simulator sickness,” that queasy feeling that something is just not right as they navi... » read more

Why Build New Silicon?
By Ann Mutschler - 14 Jan, 2016 - Comments: 1

You can’t turn around these days without hearing talk of our increasingly connected lives, tethered by the Internet of Everything (IoE), and cloud this, cloud that. Don’t get me wrong, I’m not knocking this next big thing because on many levels it is inspiring creativity, as all big things do. And the ramifications are still getting worked out as far as the impact on chip design, and t... » read more

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