Heterogeneous SoC architectures complicate security implementation and integration efforts.
The transformative shift towards the software-defined vehicle (SDV) continues as one of the greatest megatrends shaping the automotive industry. A new era of customer-centric mobility presents data-based revenue opportunities across the automotive value chain and ecosystem. However, this transition also presents many challenges, from managing increasingly complex hardware (HW) and software (SW) design and integration to meeting stringent safety and security regulations for compliance and market access. In addition, there is the constant pressure to achieve faster time to market (TTM) while delivering innovative solutions that enhance the customer driving experience.
Automotive-grade SoCs continue to evolve dramatically, especially in the recent past, transitioning from simple microcontroller-based chips, to heterogeneous microprocessor-based SoCs, to sophisticated chiplet based architectures. This transformation has been driven by demands for advanced computing power to support diverse functionality and applications including infotainment, intelligent cockpit, advanced driver-assistance systems (ADAS) and automation. These powerful SoCs lay the foundation for future-proof SDVs. However, these heterogeneous architectures pose significant challenges, complicating security implementation and integration efforts for automotive OEMs and Tier 1 system architects and engineering teams.
Hardware Security Modules (HSMs) have emerged as a key component in automotive cybersecurity. These modules offer tamper-resistant cryptographic operations and secure key management. Originally standalone chips, or embedded within automotive microcontrollers, HSMs have evolved into siloed HW blocks (IP) instantiated in SoCs, reflecting the industry’s increased emphasis on cybersecurity.
To address the challenges posed by complex SoC architectures and stringent safety and security requirements, an integrated approach to the HSM hardware and software stack is essential. More specifically, synthesizable HSM HW IP needs to come with pre-integrated, pre-validated embedded HSM SW. This enables a technology-node agnostic, full HW IP-SW stack ready to be integrated into any SoC accelerating HW development and allowing the security SW integration development to start 18-24 months earlier at the Tier 1 or OEM level.
ETAS and Rambus have worked together to offer just such an integrated solution. An integrated hardware security module (iHSM) product family combines the Rambus RT-64x Root of Trust silicon IP with the ETAS embedded cybersecurity software solution, ESCRYPT CycurSoC. This solution, designed for automotive security use cases, offers a pre-integrated, pre-validated SW-HW security stack, critical for establishing a security enclave on next-generation automotive silicon designs.
Key features include:
Use cases enabled include:
An iHSM solution offers automotive stakeholders a comprehensive and streamlined approach to security integration. By reducing implementation complexity and risk while accelerating time to market, this collaboration sets a new standard for safety and security in the automotive industry. For more information, my colleague Omar Alshabibi from ETAS and I have hosted a webinar available on demand: Meeting Automotive Design, Safety and Security Challenges with an Integrated HSM Solution.
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