Author's Latest Posts

Ensuring Memory Reliability Throughout the Silicon Lifecycle

By Anand Thiruvengadam and Guy Cortez Memories are everywhere in modern electronics. Discrete memory chips account for much of the space on printed circuit boards (PCBs). Embedded memories consume much of the floorplan in system-on-chip (SoC) devices. Many multi-die chip configurations, including 2.5D/3DIC devices, are driven by the need for faster memory access. Designing and verifying memo... » read more

Digitizing Memory Design And Verification To Accelerate Development Turnaround Time

By Anand Thiruvengadam, Farzin Rasteh, Preeti Jain, and Jim Schultz Some digital design and verification engineers imagine that their colleagues working on analog/mixed-signal (AMS) chips are jealous. After all, the digital development flow has enjoyed the benefits of increased automation and higher levels of abstraction for many years. Hand-instantiated devices and manual interconnection we... » read more

Memory Design Shift Left To Achieve Faster Development Turnaround Time

As noted in a recent blog post, demand for more memory is a common theme for many semiconductor-driven products. Artificial intelligence (AI) and machine learning (ML) algorithms rely on fast, plentiful memory for real-time performance, and storage at all levels is key to data-intensive applications. General-purpose memory devices are giving way to customized chips for applications such as AI, ... » read more

A New Vision For Memory Chip Design And Verification

Discrete memory chips are arguably the most visible reminder of the opportunities and challenges for advanced semiconductor design. They are manufactured in huge quantities, becoming key drivers for new technology nodes and new fabrication processes. Price fluctuations have a major impact on the financial health of the electronics industry, and any shortages can shut down the manufacturing line... » read more

Time To Rethink Memory Chip Design And Verification

It’s no secret to anyone that semiconductor development grows more challenging all the time. Each new process technology node packs more transistors into each die, creating more electrical issues and making heat dissipation harder. Floorplanning, logic synthesis, place and route, timing analysis, electrical analysis, and functional verification stretch electronic design automation (EDA) tools... » read more