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Ann Mutschler

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Ann Mutschler is executive editor at Semiconductor Engineering.

Author's Latest Posts

New Data Management Challenges
By Ann Mutschler - 13 Sep, 2022 - Comments: 0

An explosion in semiconductor design and manufacturing data, and the expanding use of chips in safety-critical and mission-critical applications, is prompting chipmakers to collect and manage that data more effectively in order to improve overall performance and reliability. This collection of data reveals a number of challenges with no simple solutions. Data may be siloed and inconsistent, ... » read more

Design For Security Now Essential For Chips, Systems
By Ann Mutschler - 01 Sep, 2022 - Comments: 0

It's nearly impossible to create a completely secure chip or system, but much can be done to raise the level of confidence about that security. In the past, security was something of an afterthought, disconnected from the architecture and added late in the design cycle. But as chips are used increasingly in safety- and mission-critical systems, and as the value of data continues to rise, the... » read more

Challenges Grow For Modeling Auto Performance, Power
By Ann Mutschler - 17 Aug, 2022 - Comments: 0

Rising complexity in automobiles is creating huge challenges about how to add more safety and comfort features and electronics into vehicles without reducing the overall range they can travel or pricing them so high that only the rich can afford them. While the current focus is on modeling hardware and software to understand interactions between systems, this remains a huge challenge. It req... » read more

Is Standardization Required For Security?
By Ann Mutschler - 04 Aug, 2022 - Comments: 1

Semiconductor Engineering sat down to discuss chip and system security with Mike Borza, fellow and scientist on the security IP team at Synopsys; Lee Harrison, automotive IC test solutions manager at Siemens Digital Industries Software; Jason Oberg, founder and CTO of Cycuity (formerly Tortuga Logic); Nicole Fern, senior security analyst at Riscure; Norman Chang, fellow and CTO of the electroni... » read more

Bespoke Silicon Redefines Custom ASICs
By Ann Mutschler - 28 Jul, 2022 - Comments: 0

Semiconductor Engineering sat down to discuss bespoke silicon and what's driving that customization with Kam Kittrell, vice president of product management in the Digital & Signoff group at Cadence; Rupert Baines, chief marketing officer at Codasip; Kevin McDermott, vice president of marketing at Imperas; Mo Faisal, CEO of Movellus; Ankur Gupta, vice president and general manager of Siemens... » read more

Data Management Evolves
By Ann Mutschler - 19 Jul, 2022 - Comments: 0

Semiconductor Engineering sat down to discuss data management challenges with Jerome Toublanc, business development executive at Ansys; Kam Kittrell, vice president of product management in the Digital & Signoff Group at Cadence; Simon Rance, vice president of marketing at Cliosoft; Rob Conant, vice president of software and ecosystem at Infineon Technologies; and Michael Munsey, senior dir... » read more

Which Fuel Will Drive Next-Generation Autos?
By Ann Mutschler - 07 Jul, 2022 - Comments: 0

With gasoline prices hitting uncomfortable highs, consumers increasingly are looking toward non-gasoline-powered vehicles. But what ultimately will power those vehicles is far from clear. Inside the cabin and under the hood, these vehicles will be filled with semiconductors. Yet what the energy source is for those semiconductors is the subject of ongoing debate. It could be batteries, hydrog... » read more

IC Reliability Burden Shifts Left
By Ann Mutschler - 23 Jun, 2022 - Comments: 0

Chip reliability is coming under much tighter scrutiny as IC-driven systems take on increasingly critical and complex roles. So whether it's a stray alpha particle that flips a memory bit, or some long-dormant software bugs or latent hardware defects that suddenly cause problems, it's now up to the chip industry to prevent these problems in the first place, and solve them when they do arise. ... » read more

Power Domain Implementation Challenges Escalate
By Ann Mutschler - 20 Jun, 2022 - Comments: 0

The number power domains is rising as chip architects build finer-grained control into chips and systems, adding significantly to the complexity of the overall design effort. Different power domains are an essential ingredient in partitioning of different functions. This approach allows different chips in a package, and different blocks in an SoC, to continue running with just enough power t... » read more

Audio, Visual Advances Intensify IC Design Tradeoffs
By Ann Mutschler - 13 Jun, 2022 - Comments: 0

A spike in the number of audio and visual sensors is greatly increasing design complexity in chips and systems, forcing engineers to make tradeoffs that can affect performance, power, and cost. Collectively, these sensors generate so much data that designers must consider where to process different data, how to prioritize it, and how to optimize it for specific applications. The tradeoffs in... » read more

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