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System Bits: March 27


New quantum electronic material has atomic structure resembling a Japanese basketweaving pattern According to MIT, Harvard University, and Lawrence Berkeley National Laboratory researchers, a motif of Japanese basketweaving known as the kagome pattern has preoccupied physicists for decades. They reminded that kagome baskets are typically made from strips of bamboo woven into a highly symmetric... » read more

Tech Talk: Automotive Design


NetSpeed Systems CEO Sundari Mitra talks about how to speed up the design of automotive chips. https://youtu.be/cus4fStDa5c » read more

Applying Machine Learning To Chips


The race is on to figure out how to apply analytics, data mining and machine learning across a wide swath of market segments and applications, and nowhere is this more evident than in semiconductor design and manufacturing. The key with ML/DL/AI is understanding how devices react to real events and stimuli, and how future devices can be optimized. That requires sifting through an expandi... » read more

Tech Talk: Faster Simulation


Cadence’s Adam Sherer talks about how to speed up simulation in complex multi-core designs. https://youtu.be/lDgMwU5KN7U » read more

System Bits: March 20


Design has consequences Carnegie Mellon University design students are exploring ways to enhance interactions with new technologies and the power of artificial intelligence. Assistant Professor Dan Lockton teaches the course, "Environments Studio IV: Designing Environments for Social Systems" in CMU's School of Design and leads the school's new Imaginaries Lab. “We want the designers of ... » read more

System Bits: March 13


Wiring quantum computers According to MIT researchers, when we talk about “information technology,” we generally mean the technology part, like computers, networks, and software. But they reminded that the information itself, and its behavior in quantum systems, is a central focus for MIT’s interdisciplinary Quantum Engineering Group (QEG) as it seeks to develop quantum computing and oth... » read more

New Issues In Advanced Packaging


Advanced packaging is gaining in popularity as the cost and complexity of integrating everything onto a planar SoC becomes more difficult and costly at each new node, but ensuring that these packaged die function properly and yield sufficiently isn't so simple. There are a number of factors that are tilting more of the the semiconductor industry toward advanced [getkc id="27" kc_name="packag... » read more

Heterogeneous Hubbub


It’s no secret that designers today would prefer not to be restricted in their architectural choices. And who can blame them? At the same time, this sentiment has boosted interest and usage of both heterogenous architectures as well as the RISC-V ISA. To support this, companies across the design, test and verification ecosystem are ramping efforts. One such effort is the teaming of UltraSo... » read more

System Bits: March 6


Printed graphene biosensors According to researchers at the Fraunhofer Institute for Biomedical Engineering IBMT in St. Ingbert (in Germany’s Saarland region), cell-based biosensors can simulate the effect of various substances, such as drugs, on the human body in the laboratory but depending on the measuring principle, producing them can be expensive. As such, they aren’t used very often.... » read more

Autonomous Cars Have Far-Reaching Impacts


Within the semiconductor ecosystem, autonomous vehicle technology is already having a gigantic impact as far as chip and tool development, education about what this all means, new relationships and partnerships -- among other things that hit closer to home such as how autonomous vehicles will impact our professional and personal lives. Sundari Mitra, CEO of NetSpeed Systems has been closely ... » read more

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