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Innovus+ Synthesis And Implementation System
By Cadence - 14 May, 2025 - Comments: 0

The Innovus+ platform incorporates Innovus synthesis and Innovus implementation capabilities, all integrated into one unified environment for outstanding ease of use and power, performance, and area (PPA) results. Innovus+ Synthesis can be used standalone to generate physically aware netlists ready for handoff to other design teams, such as ASIC partners, or the implementation flow can conti... » read more

Flex PCBs Explained: From Materials to Applications Technical eBook
By Cadence - 30 Apr, 2025 - Comments: 0

This ebook provides a comprehensive overview of flex PCBs, highlighting their unique benefits, materials used, common challenges, and how you can overcome them. Learn about the various applications of rigid-flex/flex PCBs in modern electronics and gain insights into the future of flex design. Read more here. Fig.1: Small Flex PCB.  Source: Cadence. » read more

Accelerating SI/PI Signoff: A Shift-Left Approach to PCB Design
By Cadence - 23 Apr, 2025 - Comments: 0

In high-speed PCB design, late-stage signal integrity (SI) and power integrity (PI) issues can lead to costly redesigns and delays. This white paper explores how in-design analysis helps engineers catch and fix SI/PI challenges early, saving time, reducing risks, and ensuring first-pass success. What You’ll Learn: The Shift-Left Advantage – How early SI/PI analysis minimizes late-s... » read more

Is Liquid Cooling Right for Your Data Center: eBook
By Cadence - 09 Apr, 2025 - Comments: 0

As data centers face rising chip densities and energy costs, liquid cooling is emerging as a powerful solution. But is it the right fit for your facility? This eBook covers the essentials to help you decide. Who Should Read This eBook: -Senior management of data center operations -Data center designers and consultants -Engineers in IT and facilities management Key Takeaways: -Lear... » read more

Engineer’s Guide to Simulation of Aeroacoustics
By Cadence - 03 Apr, 2025 - Comments: 0

Aeroacoustics is the study of noise generation due to turbulent fluid motion or the interaction of aerodynamic forces with surfaces. It is a branch of acoustics that focuses on how aerodynamic sound is generated, propagated, and transmitted to the environment. This guide provides an in-depth exploration of the specific challenges and techniques associated with aeroacoustics simulations. Key ... » read more

Allegro X AI for Generative System Design
By Cadence - 26 Mar, 2025 - Comments: 0

PCB design is the act of realizing a schematic into a physical form. Currently, human designers use electronic design automation (EDA) software to combine component placement and routing to realize the electrical connectivity on a manufacturable PCB. Computer-aided design (CAD) tools have been used in the design flow since the 1970s and are now an essential part of the designer’s toolkit. Som... » read more

Application Of External CFD Modeling In Data Center Design
By Cadence - 12 Mar, 2025 - Comments: 0

Rising IT densities and AI workloads demand smarter heat management and equipment placement. This paper "Application of External CFD Modeling in Data Center Design" explores how external computational fluid dynamics (CFD) modeling provides crucial insights by resolving airflow patterns around buildings. Why Choose External CFD Modeling? Recommended by The Green Grid, it helps predict: ... » read more

Seamless ECAD and MCAD Collaboration
By Cadence - 06 Mar, 2025 - Comments: 0

Integrating electronic computer-aided design (ECAD) and mechanical computer-aided design (MCAD) systems is critical for achieving efficient and accurate design outcomes in the rapidly evolving landscape of product design. This article explores the prevalent challenges designers and engineers face in ECAD-MCAD integration and how these challenges can be effectively addressed through integrating ... » read more

Thermal Analysis Of 3D Stacking And BEOL Technologies With Functional Partitioning Of Many-Core RISC-V SoC
By Cadence - 26 Feb, 2025 - Comments: 0

Thermal challenges in 3D-IC designs can cause a significant risk in meeting performance specifications. While the pace of Moore’s Law has slowed in recent years, system technology co-optimization (STCO) promises to mitigate technology scaling bottlenecks with system architecture tuning based on emerging technology offerings, including 3D technology. This white paper analyzes the impact of mat... » read more

Data Center Solutions: Reducing the Risk of Change
By Cadence - 12 Feb, 2025 - Comments: 0

A panel of thermal and operational experts discuss the evolving challenges in the data center industry and the tools they’re using to overcome them. This eBook details the panel insights, which cover new applications, evolving thermal requirements, innovative cooling technology, and more. Download the eBook for a snapshot of how data center professionals are overcoming the current changes ... » read more

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