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Mechanical Challenges Rise With Heterogeneous Integration


Companies integrating multiple chips or chiplets into a package will need to address structural and other mechanical engineering issues, but gaps in the design tools, new materials and interconnect technologies, and a shortage of expertise are making it difficult to address those issues. Throughout most of the history of the semiconductors, few people outside of foundries worried about struc... » read more

Impact Of Increased IC Performance On Memory


Increasing performance in advanced semiconductors is becoming more difficult as chips become more complex. There are more physical effects to contend with, different use cases, and challenges in making memory go faster. In addition, aging effects that once were ignored are now becoming critical concerns. Steven Woo, fellow and distinguished inventor at Rambus, talks about different factors that... » read more

AI Becoming More Prominent In Chip Design


Semiconductor Engineering sat down to talk about the role of AI in managing data and improving designs, and its growing role in pathfinding and preventing silent data corruption, with Michael Jackson, corporate vice president for R&D at Cadence; Joel Sumner, vice president of semiconductor and electronics engineering at National Instruments; Grace Yu, product and engineering manager at Meta... » read more

Mini-Consortia Forming Around Chiplets


Mini-consortia for chiplets are sprouting up across the industry, driven by demands for increasing customization in tight market windows and fueled by combinations of hardened IP that have been proven in silicon. These loosely aligned partnerships are working to develop LEGO-like integration models for highly specific applications and end markets. But they all are starting small, because it'... » read more

MIPI’s Focus Widens


Ashraf Takla, president and CEO of Mixel, sat down with Semiconductor Engineering to talk about the evolution of MIPI, from mobile displays to automotive, chiplets, and how the standard is evolving to keep up with increasing data volumes. SE: There has been a lot of activity around MIPI in automotive. What's driving that? Takla: One of the early use-cases for MIPI, after Mobile has been ... » read more

Physically Aware NoCs


More functions, greater security risks, and increasingly complicated integration of IP and various components below 7nm is increasing the time and effort it takes to get a functioning chip out the door. In many of these devices, the network on chip is the glue between various components, but it can take up to 10% to 12% of the total area of the SoC. Andy Nightingale, vice president of product m... » read more

AI: Engineering Tool Or Threat To Jobs?


Semiconductor Engineering sat down to talk about using AI for designing and testing complex chips with Michael Jackson, corporate vice president for R&D at Cadence; Joel Sumner, vice president of semiconductor and electronics engineering at National Instruments; Grace Yu, product and engineering manager at Meta; David Pan, professor in the Department of Electrical and Computer Engineering a... » read more

Re-shoring And Rebuilding The IC Supply Chain


Raj Jammy, chief technologist at MITRE Engenuity and executive director of the Semiconductor Alliance, sat down with Semiconductor Engineering to talk about changes in the supply chain, where and how to leverage different capabilities, and why advanced packaging and manufacturing are so critical to economic security. SE: The global supply chain for semiconductors appears to be splintering. W... » read more

Keysight Acquires Cliosoft


Keysight announced today that it has acquired Cliosoft, adding IP data management and design data to its EDA portfolio. The deal comes at a time when chip designs are becoming more heterogeneous and customized, making it more difficult to keep track of a growing number of IP assets. What works for one market or sub-market may not be optimal for another. That could include everything from di... » read more

Safety, Security, And Reliability Of AI In Autos


Experts at the Table: Semiconductor Engineering sat down to talk about security, aging, and safety in automotive AI systems, with Geoff Tate, CEO of Flex Logix; Veerbhan Kheterpal, CEO of Quadric; Steve Teig, CEO of Perceive; and Kurt Busch, CEO of Syntiant. What follows are excerpts of that conversation, which was held in front of a live audience at DesignCon. Part one of this discussion is he... » read more

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