Author's Latest Posts


Making Sense Of ML Metrics


Steve Roddy, vice president of products for Arm’s Machine Learning Group, talks with Semiconductor Engineering about what different metrics actually mean, and why they can vary by individual applications and use cases. » read more

Monitoring Heat On AI Chips


Stephen Crosher, CEO of Moortec, talks about monitoring temperature differences on-chip in AI chips and how to make the most of the power that can be delivered to a device and why accuracy is so critical. » read more

Less Food, More Thought


A trillion "things" are expected to be connected to the Internet sometime in the next decade. No matter how power-efficient these things are, they probably will require enough coin-sized lithium batteries to drain the world's supply of element No. 3 on the Periodic Table. They also will increase the demand for power everywhere, and that's even before tacking on electric vehicles, the edge, robo... » read more

Less Margin, More Respins, And New Markets


Semiconductor Engineering sat down to discuss the impact of multi-physics and new market applications on chip design with John Lee, general manager and vice president of ANSYS' Semiconductor Business Unit; Simon Burke, distinguished engineer at Xilinx; Duane Boning, professor of electrical engineering and computer science at MIT; and Thomas Harms, director EDA/IP Alliance at Infineon. What foll... » read more

Changes In Data Storage and Usage


Doug Elder, vice president and general manager of OptimalPlus, talks about what’s changing in the storage and collection, including using data lakes and data engineering to break down silos and get data into a consistent format, and why it’s essential to define data up front based upon how quickly it needs to be accessed, as well as who actually owns the data. » read more

Big Shift In AI Perception


Artificial intelligence, which has been controversial since its inception, is getting a makeover. While fears about massive job displacement and autonomous killing machines will persist, and maybe even grow, AI is being portrayed as a valuable tool for people who know how to harness its capabilities. Underlying all of this is cheap compute and storage, which has made it possible to draw more... » read more

Reducing Costly Flaws In Heterogeneous Designs


The cost of defects is rising as chipmakers begin adding multiple chips into a package, or multiple processor cores and memories on the same die. Put simply, one bad wire can spoil an entire system. Two main issues need to be solved to reduce the number of defects. The first is identifying the actual defect, which becomes more difficult as chips grow larger and more complex, and whenever chi... » read more

New Challenges In Testing 5G Devices


Alejandro Buritica, senior solutions marketing manager at National Instruments, talks about what will be needed for mass-market testing of 5G devices, how to focus signals to overcome signal attenuation, and how to make over-the-air testing viable where leads are not exposed. » read more

More Data, More Processing, More Chips


Simon Segars, CEO of Arm, sat down with Semiconductor Engineering to talk about the impact of heterogeneous computing and new packaging approaches on IP, the need for more security, and how 5G and the edge will impact compute architectures and the chip industry. SE: There are a whole bunch of new markets opening up. How does Arm plan to tackle those? Segars: Luckily for us, we can design ... » read more

Using Multiple Inferencing Chips In Neural Networks


Geoff Tate, CEO of Flex Logix, talks about what happens when you add multiple chips in a neural network, what a neural network model looks like, and what happens when it’s designed correctly vs. incorrectly. » read more

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