Alternative Text

Ed Sperling

  (all posts)
Ed Sperling is the editor in chief of Semiconductor Engineering.

Author's Latest Posts

Need To Share Data Widens In IC Manufacturing
By Ed Sperling - 31 Aug, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss issues in smart manufacturing of chips, including data management and grounding, chiplets, and standards, with Mujtaba Hamid, general manager for product management for secure cloud environments at Microsoft; Vijaykishan Narayanan, vice president and general manager of India engineering and operations at proteanTecs; KT Moore,... » read more

Challenges In Ramping New Manufacturing Processes
By Ed Sperling - 30 Aug, 2023 - Comments: 0

Despite a slowdown for Moore’s Law, there are more new manufacturing processes rolling out faster than ever before. The challenge now is to decrease time to yield, which involves everything from TCAD and design technology co-optimization, to refinement of power, performance, area/cost, and process control and analytics. Srinivas Raghvendra, vice president of engineering at Synopsys, talks abo... » read more

Manual X-ray Inspection
By Ed Sperling - 28 Aug, 2023 - Comments: 0

Increased density in advanced node chips and advanced packaging offers a way to greatly improve performance and reduce power, but it also makes it harder to inspect these devices for real and latent defects. Higher density can lead to scattering of light, and heterogeneous integration in a package means it’s not always possible to see through all materials equally. Chris Rand, product line ma... » read more

Preparing For Commercial Chiplets
By Ed Sperling - 24 Aug, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss the path to commercialization of chiplets with Saif Alam, vice president of engineering at Movellus; Tony Mastroianni, advanced packaging solutions director at Siemens Digital Industries Software; Mark Kuemerle, vice president of technology at Marvell; and Craig Bishop, CTO at Deca Technologies. What follows are excerpts of tha... » read more

Speeding Up Design Closure
By Ed Sperling - 23 Aug, 2023 - Comments: 0

Increasing complexity and smaller process nodes make it far more difficult to achieve design closure for chips. There are more physical effects to model, including noise, cross-talk, and double switching effects, all of which can slow the design process. Solaiman Rahim, vice president of engineering for Synopsys’ EDA Group, talks about why it’s so important to analyze violations in design, ... » read more

Using Data More Effectively In Chip Manufacturing
By Ed Sperling - 23 Aug, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss smart manufacturing and how tools and AI can enable it for semiconductors, with Mujtaba Hamid, general manager for product management for secure cloud environments at Microsoft; Vijaykishan Narayanan, vice president and general manager of India engineering and operations at proteanTecs; KT Moore, vice president of corporate ma... » read more

Who Will Regulate Data Exchanges In Chiplets?
By Ed Sperling - 17 Aug, 2023 - Comments: 0

Scaling is still important when it comes to logic and low power, but it's no longer the main avenue for improving performance. What used to be a single chip, comprised of various IP blocks and components on a single SoC, is giving way to a heterogeneous collection of chiplets — at least for the big chipmakers and system companies at the leading edge. Chiplets are currently the best solutio... » read more

Using Generative AI To Connect Lab To Fab Test
By Ed Sperling - 08 Aug, 2023 - Comments: 0

Executive Insight: Thomas Benjamin, CTO at National Instruments, sat down with Semiconductor Engineering to discuss a new way of looking at test, using data as a starting point and generative AI as a bridge between different capabilities. SE: What are the big changes you're seeing and how is that affecting movement of critical data from the lab to the fab? Benjamin: If you walk into any m... » read more

Tradeoffs In DSP Design
By Ed Sperling - 07 Aug, 2023 - Comments: 0

More intelligence is now required in the front-, mid-, and back-haul for 5G/6G communication, requiring a mix of high performance, low power, and enough flexibility to accommodate constantly changing protocols and algorithms. One solution to these conflicting goals involves reconfigurable DSPs, in which the processing element is hardwired like an ASIC but still configurable for a variety of app... » read more

New Approaches To Sensors And Sensing
By Ed Sperling - 02 Aug, 2023 - Comments: 0

Sensors are becoming more intelligent, more complex, and much more useful. They are being integrated with other sensors in sensor fusion, so a smart doorbell may only wake up when it’s imperative to see who’s at the door, and a microphone may only send alerts when there are cries for help or sounds of glass breaking. Kim Lee, senior director of system applications engineering at Infineon, t... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy