Geir Eide

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Geir Eide is a product manager for the Tessent test products at Siemens EDA. His focus is on diagnosis, yield analysis, and silicon debug. He has previously held positions related to design-for-test, semiconductor test, and debug, in the design automation and semiconductor test industry. He earned a BS and an MS in Electrical and Computer Engineering from the University of California at Santa Barbara, and has an engineering degree from Konigsberg College of Engineering, Norway.

Author's Latest Posts

Success Stories For Packetized Scan Data
By Geir Eide - 07 Dec, 2021 - Comments: 0

Some new design-for-test (DFT) technologies are difficult, expensive, or risky to implement but offer significant benefits. Other technologies are easy to implement but offer minor improvements. The calculation of whether (or when) to adopt new technology includes consideration of the pressures of DFT today—design complexity, the lack of flexibility in hardwiring scan channels, the proliferat... » read more

Packetized Test At The International Test Conference 2021
By Geir Eide - 12 Oct, 2021 - Comments: 0

At this year’s International Test Conference (October 10-15, 2021), Siemens Digital Industries Software is showcasing IC test and lifecycle management technologies that address the key scaling challenges facing the semiconductor industry now and in the future. The two main topics from Tessent at ITC are: The rapid adoption of packetized test strategies to address design and system... » read more

The Era Of Packetized Scan Test Has Arrived
By Geir Eide - 07 Sep, 2021 - Comments: 0

For decades, process and design scaling has triggered the adoption of transformative test solutions. About twenty years ago, when at-speed test became a de-facto requirement, on-chip compression became the norm to address test data time and volume. Over the last decade, hierarchical DFT enabled DFT engineers to apply a divide and conquer on large design, improving both implementation effort and... » read more

Packetized Scan Test Delivery
By Geir Eide - 06 Jul, 2021 - Comments: 0

The traditional approach to moving scan test data from chip-level pins to core-level scan channels is under pressure due to the dramatic rise in design size, design complexity, and test adaptation. To address these challenges, we now have the option of implementing a packetized data network for scan test that moves the scan data through the SoC much more efficiently than the traditional pin-... » read more

Have It All With No-Compromise DFT
By Geir Eide - 28 Jan, 2021 - Comments: 0

The dramatic rise in manufacturing test time for today’s large and complex SoCs is rooted in the use of traditional approaches to moving scan test data from chip-level pins to core-level scan channels. The pin-multiplexing (mux) approach works fine for smaller designs but can become problematic with an increase in the number of cores and the design complexity on today’s SoCs. The next revol... » read more

Transistor-Level Defect Diagnosis
By Geir Eide - 22 Dec, 2016 - Comments: 0

Each new semiconductor process node represents exciting opportunities for suppliers of design, manufacturing, test, and failure analysis solutions. A new process means new challenges to solve, and hopefully more money to be made. On the flip side, whenever solutions that address these new challenges are presented, we seldom hear how useful these are to more mature process nodes. One technology ... » read more

Pattern Matching In Test And Yield Analysis
By Geir Eide - 23 Jun, 2016 - Comments: 1

By Jonathan Muirhead and Geir Eide It’s no secret that a successful yield ramp directly impacts integrated circuit (IC) product cost and time-to-market. Tools and techniques that help companies ramp to volume faster, while also reducing process and design variability, can be the difference between profit and loss in a competitive market. And while pattern matching technology has been aroun... » read more

Getting A Clearer Picture
By Geir Eide - 17 Apr, 2014 - Comments: 1

Scan test diagnosis is an established software-based methodology for localizing defects causing failures in digital semiconductor devices. Using structural test patterns (such as ATPG) and the design description, diagnosis turns failing test cycles into valuable data. Exactly how valuable this data is depends on the quality of the diagnosis results. A result that points to a small group of nets... » read more

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