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Jesse Allen

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Jesse Allen is the Knowledge Center administrator and a senior editor at Semiconductor Engineering.

Author's Latest Posts

Blog Review: Aug. 23
By Jesse Allen - 23 Aug, 2023 - Comments: 0

Siemens' Stephen Chavez discusses best practices when it comes to thermal analysis for PCB design, including component placement and close collaboration between mechanical and electrical engineering disciplines. Synopsys' Gary Ruggles, Richard Solomon, and Varun Agrawal introduce the Compute Express Link (CXL) specification and how it could help improve latency through computational offloadi... » read more

Research Bits: August 22
By Jesse Allen - 22 Aug, 2023 - Comments: 0

Photonic memory Researchers from Zhejiang University, Westlake University, and the Chinese Academy of Sciences developed a 5-bit photonic memory capable of fast volatile modulation and proposed a solution for a nonvolatile photonic network supporting rapid training. This was made possible by integrating the low-loss phase-change material (PCM) antimonite (Sb2S3) into a silicon photonic plat... » read more

Blog Review: Aug. 16
By Jesse Allen - 16 Aug, 2023 - Comments: 0

Synopsys' Johannes Stahl and Tim Kogel suggest that multi-die systems require a new approach at the architecture planning phase and why chip designers can’t ignore physical effects such as layout, power, temperature, or IR-drop. Siemens' Rich Edelman argues for using the waveform window in a GUI rather than $display when debugging UVM. Cadence's Paul Scannell stresses the need for diver... » read more

Research Bits: August 15
By Jesse Allen - 15 Aug, 2023 - Comments: 0

Using noise for spintronics Researchers from the Institute for Basic Science built a vertical magnetic tunneling junction device by sandwiching a few layers of vanadium in tungsten diselenide (V-WSe2), a magnetic material, between top and bottom graphene electrodes to create high-amplitude Random Telegraph Noise (RTN) signals. Through the resistance measurement experiments using these devic... » read more

Week In Review: Design, Low Power
By Jesse Allen - 11 Aug, 2023 - Comments: 0

U.S. President Joe Biden issued an executive order to restrict U.S. investment in Chinese companies, targeting semiconductors and microelectronics, quantum information technologies, and artificial intelligence systems with military or intelligence applications. Specific technologies within these groups will be defined later. Some will only require investors to notify the Department of the Tre... » read more

Blog Review: Aug. 9
By Jesse Allen - 09 Aug, 2023 - Comments: 0

Synopsys' John Swanson and Manmeet Walia note that designing for 224G Ethernet will entail some unique considerations, as design margins will be extremely tight, making it mission-critical to optimize individual analog blocks to reduce impairments. Cadence's Rick Sanborn finds that knowing how best to debug common partitioning-related issues and implicitly control them using common features ... » read more

Research Bits: Aug. 7
By Jesse Allen - 07 Aug, 2023 - Comments: 0

Stretchy semiconductors Researchers from Pennsylvania State University, University of Houston, Southeast University, and Northwestern University are working towards fully flexible electronics. “Such technology requires stretchy elastic semiconductors, the core material needed to enable integrated circuits that are critical to the technology enabling our computers, phones and so much more,... » read more

Week In Review: Design, Low Power
By Jesse Allen - 04 Aug, 2023 - Comments: 0

Qualcomm, NXP, Infineon, Nordic, and Bosch are jointly investing in a new RISC-V company, to be formed in Germany, that will speed up RISC-V’s adoption in commercial products. The company will be “a single source to enable compatible RISC-V based products, provide reference architectures, and help establish solutions widely used in the industry,” according to a press release. The co... » read more

Startup Funding: July 2023
By Jesse Allen - 02 Aug, 2023 - Comments: 0

Investors pumped more than $2.8 billion into 123 companies July. It was a particularly strong month for photonics companies, with a photonic integrated circuit foundry raising more than $100 million. Startups this month also are using photonic technology in innovative ways. This includes an all-optical RISC processor, biomarker identification, faster fully homomorphic encryption, and more AI... » read more

Blog Review: Aug. 2
By Jesse Allen - 02 Aug, 2023 - Comments: 0

Siemens' Katie Tormala points to the need for die attach thermal testing to ensure efficient removal of heat dissipation from power electronics components to prevent premature failure or thermal runaway. Synopsys's Dermott Lynch notes that over 30% of semiconductor failures are attributed to electrostatic discharge, with damage ranging from leakages and shorts to junction and metallization b... » read more

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