Author's Latest Posts


Blog Review: Feb. 7


Synopsys' Ian Land, Kenneth Larsen, and Rob Aitken find that a new approach will be required to ensure that higher volume 3D heterogeneous integration (3DHI) designs can function reliably and successfully in aerospace, defense, and government systems. Siemens' John Golding provides a primer on the fundamental concepts related to signal integrity, including key topics such as transmission lin... » read more

Research Bits: Feb. 6


Laser printer for photonic circuits Researchers from the University of Washington and University of Maryland propose a faster, cheaper way to fabricate and reconfigure photonic integrated circuits. The method uses a laser writer to write, erase, and modify circuits into a thin film of phase-change material similar to what is used for recordable CDs and DVDs. The researcher say the method co... » read more

Blog Review: Jan. 31


Synopsys' William Ruby argues for a comprehensive energy-efficient design methodology for automotive ICs as today's vehicles demand ever more computing power to support electrification, communication, and processing of massive amounts of data. Cadence's Mellacheruvu Srikanth finds that verifying all the new features and enhancements across several generations of PCIe while maintaining backwa... » read more

Research Bits: Jan. 30


Etching tellurite glass Physicists from EPFL and Tokyo Tech propose a way to create photoconductive circuits, where the circuit is directly patterned onto a tellurite glass surface with femtosecond laser light. The exposure formed nanoscale tellurium and tellurium oxide crystals, both semiconducting materials. “Tellurium being semiconducting, based on this finding we wondered if it would ... » read more

Blog Review: Jan. 24


Siemens' John McMillan finds that while 3D-IC capabilities are ready for mainstream, mass adoption success depends on how easily, effectively, and efficiently a solution can be delivered and points to five workflow adoption focus areas. Cadence's Andre Baguenie shows how to easily convert a logic signal to an electrical value using Verilog-AMS and the transition filter. Synopsys' Chris Cl... » read more

Research Bits: Jan. 23


Memristor-based Bayesian neural network Researchers from CEA-Leti, CEA-List, and CNRS built a complete memristor-based Bayesian neural network implementation for classifying types of arrhythmia recordings with precise aleatoric and epistemic uncertainty. While Bayesian neural networks are useful for at sensory processing applications based on a small amount of noisy input data because they ... » read more

Blog Review: Jan. 17


Cadence's Rajneesh Chauhan introduces the Back-Invalidate feature in Compute Express Link (CXL) 3.0 and how it contributes to the efficient functioning of modern data center architectures by upholding cache coherence across multiple hosts and devices. Synopsys' Brett Murdock and Dana Neustadter point out the importance of protecting against DRAM attacks such as Rowhammer, RAMbleed, and cold-... » read more

Research Bits: Jan. 16


3D stacking of 2D materials Researchers from Penn State University demonstrated monolithic 3D integration with 2D transistors made from 2D semiconductors called transition metal dichalcogenides. The 2D materials have unique electronic and optical properties, including sensitivity to light, making them ideal for use as sensors. “One challenge is the process temperature ceiling of 450 degre... » read more

Startup Funding: December 2023


Photonics and optics were strong in December, with investors funding two different companies using photonic technologies to develop AI chips and interconnects. Another key area — metaoptics — combines what traditionally would be separate lenses and optical components into a single, flat nanopatterned device. Metaoptics are being deployed in applications ranging from AI processing and sensor... » read more

Research Bits: Jan. 8


High mobility graphene Researchers at the Georgia Institute of Technology and Tianjin University created a functional semiconductor made from graphene that is compatible with conventional microelectronics processing methods. "We now have an extremely robust graphene semiconductor with 10 times the mobility of silicon, and which also has unique properties not available in silicon," said Walt... » read more

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