Blog Review: Feb. 7

3DHI for government systems; signal integrity; eUSB2; asymmetric wafer map defects.


Synopsys’ Ian Land, Kenneth Larsen, and Rob Aitken find that a new approach will be required to ensure that higher volume 3D heterogeneous integration (3DHI) designs can function reliably and successfully in aerospace, defense, and government systems.

Siemens’ John Golding provides a primer on the fundamental concepts related to signal integrity, including key topics such as transmission lines, termination, crosstalk, differential pairs, vias and impairments, and timing.

Cadence’s Sanjeet Kumar explores how the embedded USB2 (eUSB2) Physical Layer Supplement supports a low voltage, power-efficient USB 2.0 PHY solution by eliminating the need for 3.3V IO signaling in small process technologies.

Lam Research’s James Kim shares a technique to identify asymmetric wafer map defects caused by a biased deposition or etch process, which can cause performance variability at different wafer locations.

Arm’s Parag Beeraka finds that successfully deploying ML models on resource-constrained hardware requires edge AI expertise that can span data science, machine learning, and specialized embedded engineering disciplines.

Keysight’s Carrie Browen checks out ASA Motion Link, an application-specific communication link for in-vehicle networks that supports the asymmetry of typical display, camera, and sensor applications.

Ansys’ Raha Vafaei introduces the basics of photonics and optics, including applications and key trends such as miniaturization and photonic integrated circuits.

The ESD Alliance’s Bob Smith chats with Aki Fujimura of D2S about curvilinear chip design, what has changed to make it possible, and why he thinks it will ultimately replace the traditional Manhattan routing methods.

Memory analyst Jim Handy considers the recent surge of interest in processing in memory (PIM) and looks back at a notable computer that used PIM back in the 1960s to trim the weight and power consumption of a spacecraft by reducing the complexity of the CPU.

Plus, check out the blogs featured in the latest Automotive, Security & Pervasive Computing newsletter:

Synopsys’ Charles Dittmer looks at the ubiquitous technology in consumer electronics that is poised to boost communications in and around a vehicle.

Flex Logix’s Jayson Bethurem dives into a lower-cost hybrid solution that increases product lifespan and competitive differentiation in markets such as networking, AI, and more.

Rambus’ Adiel Bahrouch highlights partnerships that aim to integrate AI capabilities into vehicles and why cybersecurity remains key.

Renesas’ Sailesh Chittipeddi details the benefits of shifting manufacturing from an analytic to a predictive model to address shift left and supply chain decentralization.

Infineon’s Omar Cruz explains why processing data locally enables edge AI to perform faster inference and support real-time use cases.

Cadence’s Veena Parthan takes a drive through 100 years of automotive body styles.

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