Variation’s Long, Twisty Tail Worsens At 7/5nm


Variation is becoming a bigger challenge at each new node, but not just for obvious reasons and not always from the usual sources. Nevertheless, dealing with these issues takes additional time and resources, and it can affect the performance and reliability of those chips throughout their lifetimes. At a high level, variation historically was viewed as a mismatch between what design teams in... » read more

Survey: EUV Optimism Grows


The confidence level remains high for extreme ultraviolet (EUV) lithography, although the timing of the insertion remains a moving target, according to a new survey released by the eBeam Initiative. At the same time, the outlook for the overall photomask industry is bullish, according to the survey. On the downside, however, there appears to be no progress in terms of improving mask turnaro... » read more

Week In Review: Manufacturing, Test


Fab/mask manufacturing An alliance of companies have formed the Center for Deep Learning in Electronics Manufacturing (CDLe). NuFlare, Mycronic and D2S have established the San Jose, Calif.-based center to advance the state-of-the-art in deep learning for its industry-specific applications. Imec.xpand, an early-stage and growth fund that is initiated by Imec, has closed its first fund at 11... » read more

Mixed Outlook For Semi Biz


Both the IC and fab equipment industries have been enjoying a boom cycle for some time, but they could be facing speed bumps and possibly turbulence in the second half of this year and into 2019. In the first half of 2018, the industry was fueled by the momentum carried over from 2017. DRAM prices remained relatively high, which contributed to the revenue growth in the overall IC industry. M... » read more

Fabs Meet Machine Learning


Aki Fujimura, chief executive of D2S, sat down with Semiconductor Engineering to discuss Moore’s Law and photomask technology. Fujimura also explained how artificial intelligence and machine learning are impacting the IC industry. What follows are excerpts of that conversation. SE: For some time, you’ve said we need more compute power. So we need faster chips at advanced nodes, but cost... » read more

Big Trouble At 3nm


As chipmakers begin to ramp up 10nm/7nm technologies in the market, vendors are also gearing up for the development of a next-generation transistor type at 3nm. Some have announced specific plans at 3nm, but the transition to this node is expected to be a long and bumpy one, filled with a slew of technical and cost challenges. For example, the design cost for a 3nm chip could exceed an eye-p... » read more

What’s Missing In EUV?


Extreme ultraviolet (EUV) lithography is expected to move into production at 7nm and/or 5nm, but as previously reported, there are some gaps in the arena. At one time, the power source was the big problem, but that appears to be solved in the near term. Now, a phenomenon called stochastic effects, or random variations, are the biggest challenge for EUV lithography. But at most events, th... » read more

More Lithography/Mask Challenges


Semiconductor Engineering sat down to discuss lithography and photomask technologies with Gregory McIntyre, director of the Advanced Patterning Department at [getentity id="22217" e_name="Imec"]; Harry Levinson, senior fellow and senior director of technology research at [getentity id="22819" comment="GlobalFoundries"]; Regina Freed, managing director of patterning technology at [getentity id="... » read more

Next EUV Issue: Mask 3D Effects


As extreme ultraviolet (EUV) lithography moves closer to production, the industry is paying more attention to a problematic phenomenon called mask 3D effects. Mask 3D effects involve the photomask for EUV. In simple terms, a chipmaker designs an IC, which is translated from a file format into a photomask. The mask is a master template for a given IC design. It is placed in a lithography scan... » read more

Masks, Models And Alternative Lithography


Every February an outstanding group of eBeam luminaries gathers at events hosted by the eBeam Initiative during the SPIE Advanced Lithography conference. It was our 10th annual lunch with standing room only attendance again this year. It’s an honor to get to know some of these very talented people. We started producing videos for the community over five years ago to share more of their storie... » read more

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