Single Vs. Multi-Patterning Advancements For EUV


As semiconductor devices become more complex, so do the methods for patterning them. Ever-smaller features at each new node require continuous advancements in photolithography techniques and technologies. While the basic lithography process hasn’t changed since the founding of the industry — exposing light through a reticle onto a prepared silicon wafer — the techniques and technology ... » read more

Photoresist Materials Development


Toru Fujimori of FUJIFILM Corporation provides an overview of the development of photoresist materials for masks and wafers to support continued pattern shrinkage and address stochastic issues in lithography. » read more

GPU Acceleration for Pixel-based Computing in Various Mask Processing and Verification Steps


A technical paper titled "Leaping into the curvy world with GPU accelerated O(p) computing" was published by researchers at D2S, Inc. The papers discusses the advantages of using GPU acceleration for pixel-based computing during various mask processing and verification steps.  It found that the O(p) approach for GPU acceleration is effective in handling data processing for curvy masks. F... » read more

Opportunities Grow For GPU Acceleration


Experts at the Table: Semiconductor Engineering sat down to discuss the impact of GPU acceleration on mask design and production and other process technologies, with Aki Fujimura, CEO of D2S; Youping Zhang, head of ASML Brion; Yalin Xiong, senior vice president and general manager of the BBP and reticle products division at KLA; and Kostas Adam, vice president of engineering at Synopsys. W... » read more

A Wrap-Up Of Photomask Japan 2024


This year, I had the opportunity to attend the 30th Symposium on Photomask and NGL Mask Technology, also called Photomask Japan 2024 (PMJ), in Yokohama, Japan, from April 16 to 18. This well-regarded symposium brings together engineers from all over the world to share ideas on photomasks, NGL masks and related technologies. It was great being back to an in-person conference after four years ... » read more

Navigating The GPU Revolution


Experts at the Table: Semiconductor Engineering sat down to discuss the impact of GPU acceleration on mask design and production and other process technologies, with Aki Fujimura, CEO of D2S; Youping Zhang, head of ASML Brion; Yalin Xiong, senior vice president and general manager of the BBP and reticle products division at KLA; and Kostas Adam, vice president of engineering at Synopsys. What f... » read more

eBeam Initiative Marks Major Milestones Over 15 Years Of Photomasks And Lithography


The eBeam initiative celebrated its 15th anniversary at the recent SPIE Advanced Lithography + Patterning Conference. 130 members of the mask and lithography community attended the annual lunch to mark the milestone. The eBeam Initiative welcomed its 53rd member, FUJIFILM Corporation, having grown from 20 members and advisors at its launch. FUJIFILM is the first company from the chemical supply... » read more

Chip Industry Technical Paper Roundup: March 26


New technical papers recently added to Semiconductor Engineering’s library. [table id=209 /] Find last week's technical paper additions here. » read more

Predicting Warpage in Different Types of IC Stacks At Early Stage Of Package Design


A new technical paper titled "Warpage Study by Employing an Advanced Simulation Methodology for Assessing Chip Package Interaction Effects" was published by researchers at Siemens EDA, D2S, and Univ. Grenoble Alpes, CEA, Leti. Abstract: "A physics-based multi-scale simulation methodology that analyses die stress variations generated by package fabrication is employed for warpage study. The ... » read more

Chip Industry Technical Paper Roundup: Mar. 11


New technical papers added to Semiconductor Engineering’s library this week. [table id=205 /] More ReadingTechnical Paper Library home » read more

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