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Jesse Allen

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Jesse Allen is the Knowledge Center administrator and a senior editor at Semiconductor Engineering.

Author's Latest Posts

Power/Performance Bits: Sept. 21
By Jesse Allen - 21 Sep, 2021 - Comments: 0

Catching switches in action Researchers from SLAC National Accelerator Laboratory, Stanford University, Hewlett Packard Labs, Penn State University, and Purdue University observed atoms moving inside an electronic switch as it turns on and off, revealing a state they suspect could lead to faster, more energy-efficient devices. "This research is a breakthrough in ultrafast technology and sci... » read more

Week In Review: Design, Low Power
By Jesse Allen - 17 Sep, 2021 - Comments: 0

MoSys, a provider of SRAM solutions and networking accelerators, and Peraso Technologies, a provider of 5G mmWave devices, are merging. Stockholders of Peraso are expected to hold a 61% equity interest in the combined company, with the remaining 39% equity interest to be retained by the stockholders of MoSys. Peraso CEO Ronald Glibbery said, "By joining with MoSys, we believe we can deliver a b... » read more

Blog Review: Sept. 15
By Jesse Allen - 15 Sep, 2021 - Comments: 0

Synopsys' Ian Land and Ricardo Borges examine how radiation modeling can help ensure semiconductor components will survive while housed in equipment that is orbiting our planet or traveling through deep space over extensive periods of time. Siemens EDA's Rich Edelman explores why writing coverage is an art requiring imagination, practice, and patience, along with some tips on how to improve.... » read more

Power/Performance Bits: Sept. 14
By Jesse Allen - 14 Sep, 2021 - Comments: 0

Thermal management material Engineers at the University of California Los Angeles integrated a new thermal management material, boron arsenide, with a HEMT chip to demonstrate the material's potential. The team developed boron arsenide as a thermal management material in 2018 and found it to be very effective at drawing and dissipating heat. In the latest experiments, they used wide band... » read more

Week In Review: Design, Low Power
By Jesse Allen - 10 Sep, 2021 - Comments: 0

Tools & IP Cadence and Samsung Foundry are offering Mixed-Signal OpenAccess-ready process design kit (PDK) technology files that support a range of Samsung process technologies from 28FDS to GAA base 3nm. Enabling access to mixed-signal designs in a common OpenAccess database, the co-design methodology promotes shared responsibilities and collaboration between the analog and digital teams ... » read more

Blog Review: Sept. 8
By Jesse Allen - 08 Sep, 2021 - Comments: 0

Synopsys' Scott Durrant considers the IP used in HPC SoCs and the efforts to simultaneously minimize data movement and maximize the speed at which data is transferred from one location to another, whether that data transfer is across long distances or from one chip to another within a server. Cadence's Paul McLellan looks into a new version of the Rowhammer DRAM vulnerability that can allow ... » read more

Power/Performance Bits: Sept. 8
By Jesse Allen - 08 Sep, 2021 - Comments: 0

Backscatter radios for 5G Researchers at the Georgia Institute of Technology, Nokia Bell Labs, and Heriot-Watt University propose using backscatter radios to support high-throughput communication and 5G-speed Gb/sec data transfer using only a single transistor. “Our breakthrough is being able to communicate over 5G/millimeter-wave (mmWave) frequencies without actually having a full mmWave... » read more

Week In Review: Design, Low Power
By Jesse Allen - 03 Sep, 2021 - Comments: 0

Synaptics will acquire DSP Group, a provider of voice and wireless chipset solutions for converged communications, at $22.00 per share in an all-cash transaction. The deal is worth $538 million. "We continue to invest in technologies that tilt our product mix toward IoT applications," said Michael Hurlston, President and CEO of Synaptics. "DSP Group's expertise in SmartVoice and ULE wireless so... » read more

Blog Review: Sept. 1
By Jesse Allen - 01 Sep, 2021 - Comments: 0

Arm's Fernando Garcia Redondo, Pranay Prabhat, and Mudit Bhargava continue their exploration of MRAM simulation by explaining stochasticity experiments and a characterization framework that focuses on the MRAM behavior statistical analysis. Siemens EDA's Neil Johnson shows how performance profiling can be used to identify testbench code that could slow down simulation and when to start using i... » read more

Startup Funding: August 2021
By Jesse Allen - 01 Sep, 2021 - Comments: 0

More than $3.5 billion in funding was funneled into 35 startups last month, much of that scattered across the globe. Several Chinese companies received significant funding as the country bulks up domestic production of wafers and GPUs. In addition, with attention increasing on the need for electric vehicles and renewable energy, big investments went into battery manufacturing startups. One comp... » read more

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