Blog Review: Jan. 19

Memory design challenges; 3D packaging; PCB multiphysics; keyword spotting.


Synopsys’ Anand Thiruvengadam examines the memory chip design challenges of optimizing PPA, speeding turnaround time, and improving reliability and how a shift-left approach can help.

Cadence’s Paul McLellan checks out some of TSMC’s recent updates in 3D packaging and the importance of thermal analysis and finding the right balance between IR-drop and TSV usage in multi-chip physical verification.

Siemens’ Katie Tormala checks out an approach to simulate multiphysics phenomena on the PCB while considering all nets with the maximum level of detail, without the need to convert EDA data into a CAD model.

Arm’s Axel Berg examines on-device keyword spotting for voice assistants through the use of Transformer networks, which provide both the accuracy and latency necessary.

Ansys’ Jennifer Procario checks out how thermal simulation is being used to help design a system that uses high-temperature solar heat to convert CO2 and water into synthetic fuels, such as solar gasoline, diesel, or jet fuel, that are compatible with conventional internal combustion engines and aircraft turbines.

In a blog for SEMI, Peter Gillespie of Advanced Energy looks at the evolution of plasma process power and why it’s time to re-think how power is managed in plasma-based applications.

Applied Materials’ Sundeep Bajikar finds that the industry is changing, with demand and investments for semiconductor manufacturing becoming more evenly distributed between leading nodes and those focused on IoT, communications, automotive, power, and sensors.

NXP’s Konrad Lorentz points to the battery junction box as a key component of an electric vehicle’s battery management system, enabling it to measure and log the total battery voltage and the current flowing in and out of the battery and allowing a precise calculation of its state of charge.

Plus, be sure to check out the blogs featured in the latest Low Power-High Performance newsletter:

Siemens EDA’s Mark Eslinger and Jin Hou present a step-by-step method for refining the results of formal verification.

Synopsys’ Jerry Lotto takes a fresh look at the evolution of Ethernet, from supporting home networking to enabling hyperscale and cloud data centers.

Arm’s Chris Shore examines the digitization of the grid and its impact on the semiconductor industry.

Rambus’ Tim Messegee finds that some of the most fundamental changes in the PCIe 6.0 standard are pushing up signaling rates.

Ansys’ Ronak Shah shows how multiphysics simulation is helping shape power conversion solutions for the electricity transmission network of the future.

Cadence’s Paul McLellan weighs in on the hybrid version of this year’s consumer electronics event.

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