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Katherine Derbyshire

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Katherine Derbyshire is a technical editor at Semiconductor Engineering.

Author's Latest Posts

Saving Energy In The Fab
By Katherine Derbyshire - 09 Nov, 2016 - Comments: 7

It’s not an exaggeration to say that integrated circuits are a critical component of any effort to reduce global carbon dioxide emissions. The most efficient engines depend on microcontrollers to optimize fuel consumption. Global shipping uses sophisticated simulators for load balancing and route planning. Computing power that once needed room-sized cooling units now fits in a battery-powered... » read more

Making Manufacturing Sustainable For Chips
By Katherine Derbyshire - 28 Sep, 2016 - Comments: 5

There is widespread agreement that fabs and manufacturers in general should operate in a sustainable way, but what exactly does that mean? And what concrete steps can fabs take toward that goal? Once we get past the simplistic “more sustainable is better,” things tend to get pretty fuzzy. Consider the definition of sustainability itself. Corporate responsibility reports and similar docum... » read more

Think Globally, Act Globally
By Katherine Derbyshire - 26 Sep, 2016 - Comments: 1

For the last several months, I’ve been working on a series of articles about sustainable manufacturing in the semiconductor industry. How can we, as an industry, reduce our environmental footprint? It’s a big topic, and it’s been challenging to find concrete examples of ways fabs can reduce power consumption, water consumption, and greenhouse gas emissions. I’ll address these topics in ... » read more

Good Filters, Poor Resists
By Katherine Derbyshire - 14 Sep, 2016 - Comments: 0

Shrinking feature sizes and more complex lithography schemes are increasing the pressure on all aspects of the lithography process, including resists and resist filtration. As Clint Haris, vice president and general manager for liquid micro contamination control at Entegris explained, fabs are pushing resist manufacturers toward more stringent control of both contaminants and “soft particl... » read more

Stacking Logic On Logic
By Katherine Derbyshire - 21 Jul, 2016 - Comments: 0

Advanced packaging can be an alphabet soup of possible approaches, from heterogenous integration of multiple die types into a single package, to three-dimensional stacking of multiple dies on top of each other. Three-dimensional chip stacking is most commonly seen in memory devices. Applied to logic, though, there are at least two different ways for integration to proceed. Completely process... » read more

FD-SOI Strains For The Future
By Katherine Derbyshire - 11 Jul, 2016 - Comments: 0

One of the challenges facing supporters of FD-SOI is the need to provide a pathway to improved performance. While FD-SOI wafers offer some significant advantages over bulk silicon wafers, performance enhancements like strain and alternative channel materials are more difficult to implement in the thin SOI environment. On the other hand, once a fab is willing to incorporate layer transfer techni... » read more

TSVs: Copper, Silicon, And CTE Mismatch
By Katherine Derbyshire - 23 Jun, 2016 - Comments: 3

As previous articles in this series have discussed, advanced packages introduce new materials and new reliability concerns. Diffusion into solder bumps can create brittle, high resistance, intermetallic compounds. Heat transfer through an interposer can degrade the lifetime of even cool, low power chips. Still, through-silicon vias are unique in that they cut directly through the integrated cir... » read more

Electromigration: Not Just Copper Anymore
By Katherine Derbyshire - 31 May, 2016 - Comments: 2

While integrated circuit manufacturers have worried about electromigration for a long time, until recently most of their concerns have focused on the on-chip interconnects. The larger dimensions found in integrated circuit packages have, in most cases, improved heat dissipation, reduced current density, and eliminated most [getkc id="160" kc_name="electromigration"] risks. Over the last sev... » read more

Building A Better Resonator
By Katherine Derbyshire - 19 May, 2016 - Comments: 0

The resonant frequency of a beam depends on the mass and stiffness of the beam. Resonance has always been important in the design of musical instruments and amplification systems, as well as the design of bridges and buildings. With the advent of MEMS fabrication techniques, though, came the ability to create very small beams, in the micron or nanometer size range, with resonant frequencies ... » read more

Keeping The Whole Package Cool
By Katherine Derbyshire - 12 May, 2016 - Comments: 0

Heat dissipation is a critical issue for designers of complex chip-stacking and system-in-package devices. The amount of heat generated by a device increases as the number of transistors goes up, but the ability to dissipate the heat depends on the package surface area. Because the goal of 3D packaging is to squeeze more transistors into less overall space, new heat dissipation issues are em... » read more

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