Kim Yess

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Kim Yess is technology director for the Wafer Level Packaging Materials (WLPM) business unit at Brewer Science. Yess holds several patents in the area of anti-reflective chemicals developed specifically for the integrated circuits industry, etch protective materials used for applications within the MEMS arena, and polymeric adhesives and processes for wafer-thinning and packaging applications. Yess serves on several technical committees for conference organizations, including ECTC and IMAPS. She holds an MBA from Webster University and a BA in Biology/Chemistry from Central Missouri State University.

Author's Latest Posts

Solving Fan-Out Wafer-Level Warpage Challenges Using Material Science

By Kim Yess - 10 Sep, 2018 - Comments: 0

Now more than ever we’re finding that semiconductor process engineers are turning to material scientists to help find solutions for their most complex challenges. Currently, they are looking for ways to improve fan-out wafer-level packaging (FOWLP), one of today’s hottest technologies for heterogeneous integration. Often, with these new advanced solutions come challenges that can impact ... » read more

Temporary Bonding: Enabling the Next Generation of Ultrathin Wafers

By Kim Yess - 11 Jun, 2018 - Comments: 0

Innovative materials are critical for maintaining integrity during advanced semiconductor manufacturing processes. Temporary bonding is being enabled by these new materials and is making a name for itself in the next generation of ultrathin wafer manufacturing. Semiconductor wafers are being forced to become thinner as the push to shrink feature sizes and introduce full-scale 3D integration ... » read more