From Known Good Die To Known Good System With UCIe IP

By Manuel Mota - 11 May, 2023 - Comments: 0

Multi-die systems are made up of several specialized functional dies (or chiplets) that are assembled in the same package to create the complete system. Multi-die systems have recently emerged as a solution to overcome the slowing down of Moore’s law by providing a path to scaling functionality in the packaged chip in a way that is manufacturable with good yield. Additionally, multi-die sy... » read more

What Is UCIe?

By Manuel Mota - 13 Sep, 2022 - Comments: 0

The semiconductor industry is undertaking a major strategy shift towards multi-die systems. The shift is fueled by several converging trends: Size of monolithic SoCs is becoming too big for manufacturability Some SoC functionalities may require different process nodes for optimal implementation Desire for enhanced product scalability and composability is increasing Multi-die syste... » read more

Die-to-Die Connectivity With High-Speed SerDes PHY IP

By Manuel Mota - 12 Mar, 2020 - Comments: 0

Hyperscale data center, artificial intelligence (AI), and networking SoCs have become more complex with advanced functionalities and have reached maximum reticle sizes. Designers are partitioning such SoCs in smaller modules requiring ultra- and extra-short reach links for inter-die connectivity with high data rates. The die-to-die connectivity must also ensure reliable links with extremely low... » read more

Data Converters For Automotive Applications

By Manuel Mota - 04 Oct, 2018 - Comments: 0

Sensor applications requiring data converters range from temperature sensors identifying different engine status to radar/LIDAR enabling Automotive Driver Assistance Systems (ADAS). Other applications involving data converters include wireless transceivers for communicating with other vehicles or with a fixed network. The data converter IP (analog-to-digital and digital-to-analog) provides an i... » read more