Mark LaPedus

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Mark LaPedus is Executive Editor for manufacturing at Semiconductor Engineering.

Author's Latest Posts

Week In Review: Manufacturing, Test
By Mark LaPedus - 28 Aug, 2020 - Comments: 0

Trade As reported, the U.S. recently implemented more restrictions on U.S. chip sales to Huawei. In response, SEMI has released the following statement in response to the new export control rule changes announced by the U.S. Commerce Department: “SEMI recognizes the role of export control measures to address threats to U.S. national security. However, we are very concerned the new export ... » read more

Manufacturing Bits: Aug. 25
By Mark LaPedus - 25 Aug, 2020 - Comments: 0

DNA storage for TV shows DNA storage was a hot topic about two or so years ago, but it’s been somewhat quiet since that time. DNA storage is back in the news. For the first time, Twist Bioscience has stored an episode of a new Netflix show using its synthetic DNA technology. The new show, BIOHACKERS, is a new six-part biotech thriller. Deoxyribonucleic acid (DNA) is a molecule that car... » read more

Power Amp Wars Begin For 5G
By Mark LaPedus - 24 Aug, 2020 - Comments: 2

Demand is increasing for power amplifier chips and other RF devices for 5G base stations, setting the stage for a showdown among different companies and technologies. The power amplifier device is a key component that boosts the RF power signals in base stations. It's based on two competitive technologies, silicon-based LDMOS or RF gallium nitride (GaN). GaN, a III-V technology, outperforms ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 21 Aug, 2020 - Comments: 0

Packaging Chunghwa Telecom, ASE and Qualcomm Technologies have announced plans to jointly build Taiwan's first 5G mmWave enterprise private network smart factory. As part of the plan, ASE is deploying a series of smart factory technologies within its existing Kaohsiung, Taiwan-based campus. This includes the deployment of 5G mmWave network cells in the Kaohsiung campus. Qualcomm will be ... » read more

What’s Next For Semis?
By Mark LaPedus - 20 Aug, 2020 - Comments: 0

It’s been a turbulent year in the semiconductor industry. 2020 was supposed to be a strong year. Then, the coronavirus outbreak hit. Suddenly, a large percentage of countries implemented various measures to mitigate the outbreak, such as stay-at-home orders as well as business and store closures. Economic turmoil and job losses soon followed, not to mention the human tragedy involved. M... » read more

Recovery In Flat-Panel Display Biz
By Mark LaPedus - 20 Aug, 2020 - Comments: 0

The flat-panel display market is starting to recover after a period of oversupply and lackluster growth, fueled by new technologies as well as more people working from home. The flat-panel display market is complex. Several different technologies are at play, such as liquid-crystal displays (LCDs) for TV screens and other products, as well as organic light-emitting diodes (OLEDs) for smartph... » read more

Finding Defects With E-Beam Inspection
By Mark LaPedus - 20 Aug, 2020 - Comments: 0

Several companies are developing or shipping next-generation e-beam inspection systems in an effort to reduce defects in advanced logic and memory chips. Vendors are taking two approaches with these new e-beam inspection systems. One is a more traditional approach, which uses a single-beam e-beam system. Others, meanwhile, are developing newer multi-beam technology. Both approaches have thei... » read more

Manufacturing Bits: Aug. 18
By Mark LaPedus - 18 Aug, 2020 - Comments: 0

Quantum Internet The U.S. Department of Energy (DOE) recently unveiled a strategy to develop a quantum Internet in the United States. DOE’s 17 National Laboratories will serve as the backbone of the quantum Internet, which will rely on the laws of quantum mechanics to control and transmit information over a network. Currently in its initial stages of development, the quantum Internet coul... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 14 Aug, 2020 - Comments: 0

Chipmakers At its Architecture Day this week, Intel disclosed its roadmap for the company’s next-generation microprocessors, graphics chips, FPGAs and other products. As part of the event, Intel announced some new enhancements for its existing 10nm finFET technology. Basically, it’s a mid-life kicker for the technology. Intel calls it the 10nm SuperFin technology, which is a redefinitio... » read more

Manufacturing Bits: Aug. 10
By Mark LaPedus - 10 Aug, 2020 - Comments: 0

EUV mask cleaning process TSMC has developed a new dry-clean technology for photomasks used in extreme ultraviolet (EUV) lithography, a move that appears to solve some major problems in the fab. TSMC and Samsung are in production with EUV lithography at advanced nodes, but there are still several challenges with the photomasks and other parts of the technology. Using 13.5nm wavelengths, EUV... » read more

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