Mark LaPedus

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Mark LaPedus is Executive Editor for manufacturing at Semiconductor Engineering.

Author's Latest Posts

Week In Review: Manufacturing, Test
By Mark LaPedus - 31 Jan, 2020 - Comments: 0

Coronavirus The coronavirus in China has been declared as a global health emergency by the World Health Organization (WHO). The situation appears to be much worse than SARS (severe acute respiratory syndrome), which hit in 2003. Several companies are taking precautionary measures to prevent widespread transmission of coronavirus. For example, ASE has devoted a Web page for the measures it is t... » read more

Manufacturing Bits: Jan. 28
By Mark LaPedus - 28 Jan, 2020 - Comments: 0

Fast photography The California Institute of Technology has developed a high-speed camera that can take pictures of transparent objects. The technology, called phase-sensitive compressed ultrafast photography (pCUP), can take up to 1 trillion pictures per second of transparent objects. Potentially, the technology from Caltech could be used in several applications, such as taking photos of s... » read more

Going On the Edge
By Mark LaPedus - 27 Jan, 2020 - Comments: 3

Emmanuel Sabonnadière, chief executive of Leti, sat down with Semiconductor Engineering to talk about artificial intelligence (AI), edge computing and chip technologies. What follows are excerpts of that conversation. SE: Where is AI going in the future? Sabonnadière: I am a strong believer that edge AI will change our lives. Today’s microelectronics are organized with 80% of things i... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 24 Jan, 2020 - Comments: 0

Market research What are the hot chip markets for 2020? IC Insights released its rankings of sales growth rates for each of the 33 IC product categories defined by the World Semiconductor Trade Statistics (WSTS) organization. “After posting the two worst growth rates among all IC product categories in 2019, NAND flash and DRAM are forecast to be among the top three fastest-growing IC segment... » read more

SiC Foundry Business Emerges
By Mark LaPedus - 23 Jan, 2020 - Comments: 1

Several third-party foundry vendors are entering or expanding their efforts in the silicon carbide (SiC) business amid booming demand for the technology. However, making a significant dent in the market will not be so easy for SiC foundry vendors and their customers. They are facing stiff competition from traditional SiC device vendors such as Cree, Infineon, Rohm and STMicroelectronics. ... » read more

Finding Defects In EUV Masks
By Mark LaPedus - 23 Jan, 2020 - Comments: 0

Extreme ultraviolet (EUV) lithography is finally in production at advanced nodes, but there are still several challenges with the technology, such as EUV mask defects. Defects are unwanted deviations in chips, which can impact yield and performance. They can crop up during the chip manufacturing process, including the production of a mask or photomask, sometimes called a reticle. Fortunately... » read more

5/3nm Wars Begin
By Mark LaPedus - 23 Jan, 2020 - Comments: 6

Several foundries are ramping up their new 5nm processes in the market, but now customers must decide whether to design their next chips around the current transistor type or move to a different one at 3nm and beyond. The decision involves the move to extend today’s finFETs to 3nm, or to implement a new technology called gate-all-around FETs (GAA FETs) at 3nm or 2nm. An evolutionary step f... » read more

Manufacturing Bits: Jan. 21
By Mark LaPedus - 21 Jan, 2020 - Comments: 0

New high-frequency transistors The Fraunhofer Institute for Applied Solid State Physics IAF has developed a novel high-frequency transistor type—the metal oxide semiconductor HEMT or MOSHEMT. Still in R&D, Fraunhofer’s MOSHEMT has reached record frequencies of 640GHz. MOSHEMTs are designed for the 100GHz frequency ranges and above. Applications include communications, radar and sens... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 17 Jan, 2020 - Comments: 0

Fab tools, chips and technologies What happened at the SEMI Industry Strategy Symposium (ISS) this week? The annual three-day conference of executives gave the year’s first comprehensive outlook of the global electronics manufacturing industry. Click here to see the details. CyberOptics has unveiled its new WaferSense Auto Resistance Sensor (ARS) and its CyberSpectrum software. The produc... » read more

Manufacturing Bits: Jan. 13
By Mark LaPedus - 13 Jan, 2020 - Comments: 0

Plastic gold ETH Zurich has developed an 18-carat gold nugget based on plastic. Instead of traditional metallic alloy elements, ETH’s gold nugget consists of a matrix of plastic. Weighing five to ten times less than traditional gold, ETH’s plastic gold can be used in watches, jewelry, radiation shielding, catalysis and electronics. Gold is a chemical element used in a plethora of app... » read more

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