Mark LaPedus

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Mark LaPedus is Executive Editor for manufacturing at Semiconductor Engineering.

Author's Latest Posts

RF Device And Process Biz Heats Up
By Mark LaPedus - 26 Apr, 2017 - Comments: 0

The RF device and process technology markets are heating up, especially for two critical components used in smartphones—RF switch devices and antenna tuners. RF device makers and their foundry partners continue to ramp up traditional RF switch chips and tuners based on RF SOI process technologies for today’s 4G wireless networks. And recently, [getentity id="22819" comment="GlobalFoundri... » read more

Manufacturing Bits: April 25
By Mark LaPedus - 25 Apr, 2017 - Comments: 1

Making strange hadrons CERN, the European Organization for Nuclear Research, has produced and observed what it says are the world’s first sub-atomic particles called strange hadrons. Strange hadrons are well-known sub-atomic particles with names such as Kaon, Lambda, Xi and Omega, according to CERN. Strange hadrons have never been observed until now. The observation could shed light on su... » read more

22nm Process War Begins
By Mark LaPedus - 23 Apr, 2017 - Comments: 1

Many foundry customers at the 28nm node and above are developing new chips and are exploring the idea of migrating to 16nm/14nm and beyond. But for the most part, those companies are stuck because they can’t afford the soaring IC design costs at advanced nodes. Seeking to satisfy a potential gap in the market, [getentity id="22819" comment="GlobalFoundries"], [getentity id="22846" e_name="... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 21 Apr, 2017 - Comments: 0

Fab tool vendors In the wafer fab equipment (WFE) rankings, Applied Materials was the leader in terms of market share in 2016, according to Gartner. For WFE, Lam Research jumped from fourth place in 2015 to second place in the rankings in 2016, according to Gartner. ASML was third, followed by TEL. Meanwhile, VLSI Research recently released its ranking for both front-end and backend equipment.... » read more

Sizing up China’s Fab Tool Biz
By Mark LaPedus - 20 Apr, 2017 - Comments: 0

China is pouring billions of dollars into its semiconductor industry and is building several new fabs. As reported, China is bolstering its IC industry for good reason. China is trying to reduce its huge trade imbalance in ICs. The country continues to import a large percentage of its chips from foreign vendors. Behind the scenes, China also continues to develop its domestic semiconductor eq... » read more

Inside Next-Gen Transistors
By Mark LaPedus - 20 Apr, 2017 - Comments: 0

David Fried, chief technology officer at [getentity id="22210" e_name="Coventor"], sat down with Semiconductor Engineering to discuss the IC industry, China, scaling, transistors and process technology. What follows are excerpts of that conversation. SE: In a recent roundtable discussion you talked about some of the big challenges facing the IC industry. One of your big concerns involves th... » read more

Manufacturing Bits: April 18
By Mark LaPedus - 18 Apr, 2017 - Comments: 0

3D printing on Mars Northwestern University has demonstrated the ability to print 3D-based structures using compounds that resemble Martian and lunar dust. The idea is that if humans begin to colonize the moon and Mars, they may require 3D printers. With 3D printers, humans can make small tools, buildings and other objects. For this, researchers from Northwestern have developed novel in... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 14 Apr, 2017 - Comments: 0

Fab equipment and test VLSI Research has released its top 10 semiconductor equipment supplier ranking in terms of sales in 2016. Applied Materials topped the list again, achieving a growth of 18%. ASML was second, followed by Lam Research, TEL and KLA-Tencor. Fig. 1: Ranking based on 2016 sales. Source: VLSI Research. Unic Capital Management, a Chinese-based private equity fund, announ... » read more

Manufacturing Bits: April 11
By Mark LaPedus - 11 Apr, 2017 - Comments: 0

Neuromorphic cyber microscope Sandia National Laboratories and Lewis Rhodes Labs have introduced a new cybersecurity tool called the Neuromorphic Cyber Microscope. The system is not a traditional microscope per se. It is a PCIe-based processing card build around Lewis Rhodes Labs’ neuromorphic processor. The system can accelerate complex pattern matching by over 100x while using 1,000x le... » read more

Electroplating IC Packages
By Mark LaPedus - 10 Apr, 2017 - Comments: 2

The electrochemical deposition (ECD) equipment market for IC packaging is heating up as 2.5D, 3D and fan-out technologies begin to ramp. [getentity id="22817" e_name="Applied Materials"]  recently rolled out an ECD system for IC packaging. In addition, Lam Research, TEL and others compete in the growing but competitive ECD equipment market for packaging. ECD—sometimes referred to as pl... » read more

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