Mark LaPedus

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Mark LaPedus is Executive Editor for manufacturing at Semiconductor Engineering.

Author's Latest Posts

Inside Lithography And Masks
By Mark LaPedus - 16 Mar, 2017 - Comments: 2

Semiconductor Engineering sat down to discuss lithography and photomask technologies with Gregory McIntyre, director of the Advanced Patterning Department at [getentity id="22217" e_name="Imec"]; Harry Levinson, senior fellow and senior director of technology research at [getentity id="22819" comment="GlobalFoundries"]; David Fried, chief technology officer at [getentity id="22210" e_name="Cove... » read more

China: Fab Boom or Bust?
By Mark LaPedus - 16 Mar, 2017 - Comments: 2

China’s semiconductor industry continues to expand at a frenetic pace. At present there are nearly two dozen new fab projects in China. Whether all these fab projects get off the ground is not entirely clear because the dynamics in China remain fluid. What is clear is the motivation behind this building frenzy—China is trying to reduce its huge trade imbalance in ICs. The country continu... » read more

Manufacturing Bits: March 14
By Mark LaPedus - 14 Mar, 2017 - Comments: 2

Sonic screwdrivers and tricorders Inspired by two famous TV shows, the Australian National University (ANU) has developed a futuristic handheld device that combines molecular MRI and mass spectrometry for use in chemical analysis of objects. The device was inspired by the sonic screwdriver from Doctor Who and the tricorder from Star Trek. The sonic screwdriver is a tool used in Doctor Who, ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 10 Mar, 2017 - Comments: 0

Fab tools In response to SEMI members and partners, SEMI says it is not organizing Semicon Russia 2017, or any other events in Russia this year. “In light of the current market conditions and SEMI stakeholder concerns, SEMI reached out to members and customers over the last six months to assess how to provide the most value for our community in Russia,” said Laith Altimime, president of SE... » read more

Manufacturing Bits: March 7
By Mark LaPedus - 07 Mar, 2017 - Comments: 0

Materials database Electronic materials and nanocrystals are used in a variety of applications. To integrate materials and crystals in devices, researchers must search in multiple places to discover new technologies and their various properties. On top of that, researchers may require long hours in the lab, and large computational resources, to enable new materials. Seeking to help res... » read more

What Next For OSATs
By Mark LaPedus - 06 Mar, 2017 - Comments: 0

Semiconductor Engineering sat down to discuss IC-packaging and business trends with Tien Wu, chief operating officer at Taiwan’s Advanced Semiconductor Engineering ([getentity id="22930" comment="ASE"]), the world’s largest outsourced semiconductor assembly and test (OSAT) vendor. What follows are excerpts of that conversation. SE: What’s the outlook for the IC industry in 2017? Wu:... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 03 Mar, 2017 - Comments: 2

SPIE news At this week’s SPIE Advanced Lithography conference, the industry paid close attention to the progress of extreme ultraviolet (EUV) lithography. Here’s the general report card: EUV is making noticeable progress, but there are still some challenges ahead, such as the power source, resists and pellicles. Several issues need to be resolved before chipmakers can put EUV into mass... » read more

Manufacturing Bits: Feb. 28
By Mark LaPedus - 28 Feb, 2017 - Comments: 0

‘Big G’ gravitation measurements The National Institute of Standards and Technology (NIST) has unveiled a new coordinate measuring machine (CMM). The CMM, dubbed Xenos, makes measurements that involve “big G” or the universal constant of gravitation. Basically, there are two meanings for the constant of gravity. The first is Newton’s universal law of gravitation. For this, the spe... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 24 Feb, 2017 - Comments: 0

Chipmakers Recently, Intel announced plans to invest more than $7 billion to complete its previously-announced fab in Chandler, Ariz. Targeted for 7nm processes, Fab 42 will be completed in 3 to 4 years. As reported, the fab announcement was made by U.S. President Donald Trump and Intel CEO Brian Krzanich at the White House. There is more to the story. Typically, Intel has two fabs for a gi... » read more

Fractilia: Pattern Roughness Metrology
By Mark LaPedus - 21 Feb, 2017 - Comments: 1

A new startup has emerged and unveiled a technology that addresses one of the bigger but less understood problems in advanced lithography--pattern roughness. The startup, called Fractilia, is a software-based metrology tool that analyzes the CD-SEM images of pattern roughness on a wafer. Fractilia, a self-funded startup, is led by Chris Mack and Ed Charrier. Mack, known as the gentleman sc... » read more

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