Mark LaPedus

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Mark LaPedus is Executive Editor for manufacturing at Semiconductor Engineering.

Author's Latest Posts

What Transistors Will Look Like At 5nm
By Mark LaPedus - 18 Aug, 2016 - Comments: 3

Chipmakers are currently ramping up 16nm/14nm finFET processes, with 10nm and 7nm just around the corner. The industry also is working on 5nm. TSMC hopes to deliver a 5nm process by 2020. GlobalFoundries, Intel and Samsung are doing R&D for that node. But 5nm technology presents a multitude of unknowns and challenges. For one thing, the exact timing and specs of 5nm remain cloudy. The... » read more

10nm Race Heats Up
By Mark LaPedus - 16 Aug, 2016 - Comments: 0

The 10nm process and foundry race is heating up, as Intel announced its 10nm technology at its annual conference. As part of the multi-pronged announcement, Intel’s foundry unit forged a major partnership with ARM. Specifically, ARM will make its physical intellectual-property (IP) available on Intel’s 10nm process. Intel, in turn, will offer the IP for foundry customers. And on to... » read more

Manufacturing Bits: Aug. 16
By Mark LaPedus - 16 Aug, 2016 - Comments: 0

Safer drinking water Two-dimensional materials are gaining steam in the R&D labs. 2D materials include graphene, boron nitride (BN) and the transition-metal dichalcogenides (TMDs). These materials could one day enable future field-effect transistors (FETs). One TMD, molybdenum disulfide (MoS2), is also generating interest in other fields. Molybdenum disulfide consists of two elements--moly... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 12 Aug, 2016 - Comments: 0

Chipmakers At this week’s Flash Memory Summit, Samsung rolled out several new products, including its next-generation 3D NAND device and a solid-state drive (SSD) with capacities up to 32 terabytes. At the same time, Samsung introduced a new and high-performance SSD solution, dubbed the Z-SSD. Samsung’s Z-SSD shares the fundamental structure of V-NAND and has a unique circuit design and... » read more

Manufacturing Bits: Aug. 9
By Mark LaPedus - 09 Aug, 2016 - Comments: 0

Faster FEBIDs Focused electron beam induced deposition (FEBID) is generating steam in the industry. Still in the R&D stage, FEBID makes use of an electron beam from a scanning electron microscope. Basically, it decomposes gaseous molecules, which, in turn, deposit materials and structures on a surface at the nanoscale. One of the big applications is a futuristic manufacturing technology... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 05 Aug, 2016 - Comments: 0

Chipmakers The wearables market has taken another hit. Intel has issued a safety recall for a smartwatch line from its Basis Science subsidiary. "We are issuing this safety recall of the Basis Peak watch because the watch can overheat, which could result in burns or blisters on the skin surface. It is important that you stop using your watch immediately and return it. Although we are stopping ... » read more

Manufacturing Bits: Aug. 2
By Mark LaPedus - 02 Aug, 2016 - Comments: 0

CMP replacement? For years, chipmakers have used chemical-mechanical-polishing (CMP) tools to smooth or polish the surface of a wafer. CMP works, but the technology is time-consuming and expensive. CMP can also leave unwanted residual patterns and defects near the surface. In response, Russia’s National Research Nuclear University MEPhI (Moscow Engineering Physics Institute) has help... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 29 Jul, 2016 - Comments: 0

Fab tools Lam Research’s proposed move to acquire KLA-Tencor has been pushed out for the second time. The deal was supposed to be completed by mid-2016. Then, it was pushed out to the third quarter amid regulatory issues. Now, the companies hope to close the deal by the fourth quarter of 2016. “The KLA-Tencor acquisition is expected to close in the December quarter. This reflects another p... » read more

Manufacturing Bits: July 26
By Mark LaPedus - 26 Jul, 2016 - Comments: 0

Jumping films Riken and the University of Tokyo have developed a tiny autonomous actuator. The actuator, which is based on a special material, can automatically curl up or straighten out when exposed to ambient humidity. And in certain conditions, the film can even jump into the air by itself. A video can be seen here. Researchers placed a material called guanidinium carbonate into a hig... » read more

RF GaN Gains Steam
By Mark LaPedus - 25 Jul, 2016 - Comments: 0

The RF [getkc id="217" kc_name="gallium nitride"] (GaN) device market is heating up amid the need for more performance with better power densities in a range of systems, such as infrastructure equipment, missile defense and radar. On one front, for example, RF GaN is beginning to displace a silicon-based technology for the power amplifier sockets in today’s wireless base stations. GaN is m... » read more

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