Author's Latest Posts

Electromagnetic Simulation And 3D-IC Interposers

By Matt Commens, Juliano Mologni, and Pete Gasperini Today’s 3D integrated circuit (3D-IC) technology is the culmination of 40 years of research in universities and laboratories scattered across the globe. Beginning with dynamic random-access memory (DRAM) deployments that appeared on the market a decade ago, 3D-IC has since expanded its reach. It is now decisively beginning to achieve the... » read more

The Foundations Of Computational Electromagnetics

Maxwell’s Equations can be expressed in multiple variants – there are integral and differential versions in both frequency and time domains, along with quasi-static and full-wave forms. Their elegance is evident upon sight yet for only the simplest systems are there known solutions. Thus, without assumptions to simplify the math and/or system under study, it is frequently impossible to full... » read more

Elasticity Without Compromise

At the dawn of the twenty-first century, the available RAM on a physical machine dictated, and ultimately limited, the size of designs that Ansys HFSS could simulate. This prompted engineers to buy incredibly expensive pieces of hardware — well into the six figures — to solve their most challenging problems. By necessity, engineers learned to “divide and conquer” their largest, most ... » read more