Author's Latest Posts

Supply Chain Security And Counterfeit Detection Using UCT

By proteanTecs - 11 Jan, 2022 - Comments: 0

The recent shortage of chip supply and long lead times prompted system makers to turn to second tier suppliers and distributors for fulfilling their semiconductor needs. This in turn has put the spotlight on the growing concern of fraudulent or counterfeited integrated circuits (ICs). Proteus deep data analytics based on Universal Chip Telemetry (UCT) provides a new approach to supply chain ... » read more

Multi-Layer Deep Data Performance Monitoring And Optimization

By proteanTecs - 10 Aug, 2021 - Comments: 0

Combining functional and parametric monitoring of the real-world behavior of complex SoCs provides a powerful new approach that facilitates performance optimization during development and in the field, improves security and safety, and enables predictive maintenance to prevent field failures. proteanTecs’ Universal Chip Telemetry (UCT) and Siemens’ Tessent Embedded Analytics are complementa... » read more

In-field, In-Mission Reliability Monitoring Based On Deep Data

By proteanTecs - 08 Jun, 2021 - Comments: 0

This paper describes a Deep Data approach to reliability monitoring in advanced electronics, based on degradation as a precursor for failure. By applying machine learning algorithms and analytics to data created by on-chip monitoring IPs (Agents), IC/system health and performance can be continuously monitored, at all stages of the product lifecycle. Realtime degradation analysis of critical par... » read more

Multi-Layer Deep Data Performance Monitoring And Optimization

By proteanTecs - 11 Jan, 2021 - Comments: 0

In-field In-Mission Reliability Monitoring Based On Deep Data

By proteanTecs - 11 Aug, 2020 - Comments: 0

Reliability Monitoring Of GUC 7nm High-Bandwidth Memory (HBM) Subsystem

By proteanTecs - 27 Apr, 2020 - Comments: 0

This white paper presents the use of proteanTecs’ Proteus for HBM subsystem reliability based on deep data analytics and enhanced visibility, overcoming the limitations of advanced heterogeneous packaging. It will describe the operation concept and provide results from a GUC 7nm HBM Controller ASIC. A typical CoWoS chip has hundreds of thousands of micro-bumps (u-bumps). 3-8 u-bumps are us... » read more

Degradation Monitoring

By proteanTecs - 09 Mar, 2020 - Comments: 0

This paper describes a reliability degradation modeling and monitoring method based on a combination of IC novel embedded circuits (Agents), and off-chip machine learning algorithms which infer the digital readouts of these circuits during test and operational lifetime. Together, they monitor the margin degradation of an IC, as well as other vital parameters of the IC and its environmental s... » read more

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