Author's Latest Posts


A Collaborative Data Model For AI/ML In EDA


This work explores industry perspectives on: Machine Learning and IC Design Demand for Data Structure of a Data Model A Unified Data Model: Digital and Analog examples Definition and Characteristics of Derived Data for ML Applications Need for IP Protection Unique Requirements for Inferencing Models Key Analysis Domains Conclusions and Proposed Future Work Abstra... » read more

Multi-Die Packaging Gains Steam


By Herb Reiter Many readers will be familiar with my extensive background and focus in the emerging field of 3D IC technology, including both 3D stacked die and 2.5 interposer design flows. Now, I am excited to bring my expertise and passion to Silicon Integration Initiative (Si2), where I am now Director of 3D Programs, helping Si2’s members in the Open3D Technical Advisory Board develop pr... » read more