Author's Latest Posts

Ultra-Thin Substrate Assembly Challenges For Advanced Flip Chip Package

By STATS ChipPAC - 08 May, 2017 - Comments: 0

Advanced semiconductor packaging requirements for higher and faster performance in a thinner and smaller form factor continues to grow for mobile, network and consumer devices. While the increase in device input/output (I/O) count is driven by the famous “Moore’s Law”, the packaging industry is experiencing opposing trends for more complex packaging solutions while the expected cost targe... » read more

Board Level Reliability Of Automotive Embedded Wafer-Level BGA FOWLP

By STATS ChipPAC - 10 Apr, 2017 - Comments: 0

With shrinking chip sizes, Wafer Level Packaging (WLP) is becoming an attractive packaging technology with many advantages in comparison to standard Ball Grid Array (BGA) packages. With the advancement of various fan-out Wafer Level Packaging (FOWLP) designs, this advanced technology has proven to be a more optimal and promising solution compared to fan-in WLP because of the greater design flex... » read more

Advanced Wafer Level Packaging Of RF-MEMS With RDL Inductor

By STATS ChipPAC - 06 Mar, 2017 - Comments: 0

The market for portable and mobile data access devices that are wirelessly connected to the cloud anytime and anywhere is exploding. The trend to access any network from anywhere is driving increased functional convergence in the radio, which translates into increased packaging complexity and sophistication. This is creating unprecedented demand for RF components providing more integration- in ... » read more

Advanced 3D eWLB-PoP Technology

By STATS ChipPAC - 06 Feb, 2017 - Comments: 0

The emergence and evolution of any package technology is driven by market trends as experienced by the end application. With the maturation of the mobile market, the trends for Smartphone and other mobile devices are more than ever for lower cost. Meanwhile, a higher degree of functionality and performance, thinner profile, and longer battery life are some of the additional market drivers seen ... » read more

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