Advanced Wafer Level Packaging Of RF-MEMS With RDL Inductor

How to build RF MEMS tuners in the smallest possible form factor.


The market for portable and mobile data access devices that are wirelessly connected to the cloud anytime and anywhere is exploding. The trend to access any network from anywhere is driving increased functional convergence in the radio, which translates into increased packaging complexity and sophistication. This is creating unprecedented demand for RF components providing more integration- in smaller package sizes. There are exciting interconnect technologies in wafer level packaging such as wafer level chip scale packaging (WLCSP) or fan-out wafer level packaging (FO-WLP) solutions such as embedded Wafer Level Ball Grid Array (eWLB) to meet these needs.

One of the most promising solutions to enable the required RF performance levels in mobile and wearable devices is the use of RF MEMS Tuners. Mobile original equipment manufacturers (OEMs) are rapidly adopting antenna tuning solutions to be able to provide the required signal strength across the large number of LTE spectrum bands used globally.

With RF MEMS technology now maturing, the biggest challenge to address the fast growing opportunity was to find a suitable packaging technology that can deliver RF MEMS tuners in the smallest possible form factor, while maintaining the excellent performance characteristics of the RF MEMS technology.

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