Author's Latest Posts


28nm Chip-Package Interactions In Large eWLB FO-WLP


To meet the continued demand for form factor reduction and functional integration of electronic devices, Wafer Level Packaging (WLP) is an attractive packaging solution with many advantages in comparison with standard Ball Grid Array (BGA) packages. The advancement of fan-out WLP has made it a more promising solution as compared with fan-in WLP, because it can offer greater flexibility in enabl... » read more

Board Level Reliability Improvement In eWLB


When it comes to reducing form-factor and increasing functional integration of mobile devices, Wafer Level Packaging (WLP) is an attractive packaging solution with many advantages in comparison to standard Ball Grid Array (BGA) packages. With the advancement of various fan-out WLP (FOWLP), it is a more optimal and promising solution compared to fan-in WLP because it can offer greater flexibilit... » read more

Ultra-Thin Substrate Assembly Challenges For Advanced Flip Chip Package


Advanced semiconductor packaging requirements for higher and faster performance in a thinner and smaller form factor continues to grow for mobile, network and consumer devices. While the increase in device input/output (I/O) count is driven by the famous “Moore’s Law”, the packaging industry is experiencing opposing trends for more complex packaging solutions while the expected cost targe... » read more

Board Level Reliability Of Automotive Embedded Wafer-Level BGA FOWLP


With shrinking chip sizes, Wafer Level Packaging (WLP) is becoming an attractive packaging technology with many advantages in comparison to standard Ball Grid Array (BGA) packages. With the advancement of various fan-out Wafer Level Packaging (FOWLP) designs, this advanced technology has proven to be a more optimal and promising solution compared to fan-in WLP because of the greater design flex... » read more

Advanced Wafer Level Packaging Of RF-MEMS With RDL Inductor


The market for portable and mobile data access devices that are wirelessly connected to the cloud anytime and anywhere is exploding. The trend to access any network from anywhere is driving increased functional convergence in the radio, which translates into increased packaging complexity and sophistication. This is creating unprecedented demand for RF components providing more integration- in ... » read more

Advanced 3D eWLB-PoP Technology


The emergence and evolution of any package technology is driven by market trends as experienced by the end application. With the maturation of the mobile market, the trends for Smartphone and other mobile devices are more than ever for lower cost. Meanwhile, a higher degree of functionality and performance, thinner profile, and longer battery life are some of the additional market drivers seen ... » read more