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Innovate Faster with A Multi-Die Solution
By Synopsys - 13 Nov, 2024 - Comments: 0

The semiconductor industry is experiencing a monumental shift in chip design, driven by the dramatic increase in AI compute performance requirements and limitations of Moore’s Law. The industry is adopting multi-die designs, which is the heterogeneous or homogeneous integration of dies (also called chiplets) in a single package. While multi-die design is the solution, it also introduces se... » read more

Democratizing Roots of Trust from Silicon to Software
By Synopsys - 07 Nov, 2024 - Comments: 0

With a vast amount of devices getting connected to the Internet of Things (IoT) and the growing number of low-cost attacks being developed to hack such IoT devices, it is clear that the need for embedded security solutions is rising dramatically. A security subsystem in the main system-on-chip (SoC) of a device can be deployed to offer secure cryptographic services to the applications running o... » read more

Early Architecture Performance and Power Analysis of Multi-Die Designs
By Synopsys - 30 Oct, 2024 - Comments: 0

Despite the clear advantages of multi-die designs, there are numerous new challenges that stand in the way of multi-die design realization. This white paper focuses on those challenges that can be addressed by early architecture exploration of multi-die designs, including: -System pathfinding -Memory utilization and coherency -Power/thermal management Find out how to overcome such chall... » read more

Reduce Augmented Reality Device Time-to-Market by Bringing Manufacturing Impact to Optical Simulation
By Synopsys - 24 Oct, 2024 - Comments: 0

Disruptive AR systems will push the limits of optics: limits in design, limits in manufacturing, and limits in overall system integration. The trend of optical components being integrated into more complex miniaturized systems is impacting optical software. Optical design software has been around for decades to design, simulate, and analyze any optical component from lenses and mirrors to light... » read more

Maximizing Coverage Metrics with Formal Unreachability Analysis
By Synopsys - 25 Sep, 2024 - Comments: 0

Coverage lies at the very heart of functional verification. Whether designing a single intellectual property (IP) block or a huge system on chip (SoC), verification teams need to know how well the design has been tested. Functional coverage, code coverage, toggle coverage, assertion coverage, and other metrics are widely used. Improving tests to fill in coverage holes is a key part of the proce... » read more

12 Levers to Elevate Your Software Testing
By Synopsys - 05 Sep, 2024 - Comments: 0

Software dominates automotive functions. Superior product and software quality are the key to high customer satisfaction, meeting safety requirements, and conquering tough timelines. The challenge is how to achieve maximum software quality without hiring an army of testers. This checklist describes 12 levers you can pull to help you build the most effective test team, while making your tes... » read more

Enabling Efficient Multi-Die Design Implementation and IP Integration
By Synopsys - 28 Aug, 2024 - Comments: 0

Many industry trends are driving chip developers to consider multi-die designs using advanced 2.5D and 3D technologies. Such designs enable incorporating heterogeneous and homogeneous dies in a single package, increasing density while reducing signal propagation times. However, multi-die designs introduce new challenges that must be addressed by all relevant electronic design automation (EDA) a... » read more

Requirements and Best Practices for Trustworthy Automotive Semiconductors
By Synopsys - 31 Jul, 2024 - Comments: 0

The complexity of electronic systems supporting Advanced Driver Assistance Systems (ADAS), Highly Automated Driving (HAD), and in-vehicle infotainment is growing exponentially. This, together with the move from multiple domain-specific Electronic Control Units (ECUs) to a zonal architecture will require high-performance computing. Furthermore, new use cases for Battery Electric Vehicles (BEV) i... » read more

Unifying Storage Diversity: Leveraging PCIe IP for Multi-Device, Multi Form Factor Designs
By Synopsys - 24 Jul, 2024 - Comments: 0

In the fast-paced world of data storage, designers are racing to keep up with ever-evolving interface standards and form factors. This whitepaper explores the impact of these industry shifts, focusing on the integration of PCIe interfaces within the context of varying storage device form factors like the Enterprise and Datacenter Standard Form Factor (EDSFF). PCIe designs need to be flexible in... » read more

Effective Monitoring, Test, and Repair of Multi-Die Designs
By Synopsys - 09 Jul, 2024 - Comments: 0

Despite clear advantages, there are numerous new challenges that need to be addressed for successful multi-die realization. The multi-die test challenges include: Bare chiplet level (pre-bond) Probe, dedicated/functional pads for test Test, diagnosis, and repair Interconnects (mid/post-bond) Die-to-die test access Lane test, diagnosis, and repair Multi-die ... » read more

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