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What Designers Need to Know About UALink for Scalable AI Systems


As AI workloads rapidly scale, interconnect performance, latency, and memory access become critical bottlenecks. This white paper explores how the UALink protocol enables high-speed, low-latency, and secure GPU-to-GPU communication, unlocking scalable AI architectures beyond traditional limits. Key Takeaways: Learn how UALink enables efficient GPU memory pooling at scale Understand U... » read more

Enabling the Industry’s First GPU-Accelerated Manufacturing Platform


Discover how modern chip designs are revolutionizing the lithographic process, driving the need for innovative solutions to meet the industry's demand for shorter design cycles. This whitepaper explores the significant role of GPUs in accelerating computational lithography, offering unprecedented speed-ups for EDA tools in chip development. Learn about the collaborative efforts of Synopsys, NVI... » read more

Simulate Faster with SimAI Software for High Returns at a Low Cost of Ownership


While the value of engineering simulation has been proven for decades, only a small percentage of engineers report using artificial intelligence (AI) to amplify their simulation results at scale. However, AI has the potential to make large-scale simulations even faster, more precise, and more cost-effective. AI-enabled simulation not only amplifies the performance and returns of simulatio... » read more

Navigating Software-Defined Vehicle Development


The automotive industry is experiencing a profound transformation as vehicles shift from primarily mechanical systems to high-performance, software-driven platforms. The emergence of Software-Defined Vehicles (SDVs) is reshaping the value chain, requiring OEMs and their partners to rethink design, development, and validation strategies. This content outlines how convergence of silicon and sy... » read more

Automated High-Speed Interface Routing in Multi-Die Designs


2.5D and 3D Multi-die design is revolutionizing chip integration by enabling thousands of high-speed connections between dies (also called chiplets). Discover how close placement of dies boosts bandwidth, minimizes latency, and maximizes data throughput. Read this white paper to find out about the importance of interconnectivity planning and die-to-die signal routing for successful m... » read more

Integrating Optics And Engineering: How Simulation Transforms Medical Device Design


The integration of optical systems in medical devices is a rapidly growing area of focus and investment within the medical technology sector. From surgical lasers and diagnostic imaging tools to microscopes applied in research, advanced optics have enormous potential to drive better patient outcomes. However, designing advanced optical systems for medical devices poses numerous complex... » read more

The Evolution Of Hardware Root Of Trust Security IP


Navigate hardware-based security for semiconductors with this white paper about tRoot Hardware Secure Modules (HSMs). This paper provides security solutions for protecting digital assets in an increasingly interconnected world. Key Takeaways: Understand why robust security measures are needed for AI, IoT, and high-performance computing. Discover tRoot HSMs features, including secure ... » read more

Minimizing Design Risk: Rapid Feasibility Exploration For Multi-Die Designs


Multi-die design is revolutionizing semiconductor innovation, offering unprecedented flexibility, but also introducing complexity. What if designers could spot and solve critical issues, such as IR drop, electromigration, and thermal impact before they ever reach the design implementation stage? In this white paper, we explore how rapid, comprehensive feasibility exploration enables desi... » read more

Designing for 448G: Modulation, DSP, and Channel Trade-offs in High-Speed SerDes


Discover practical solutions and engineering insights for deploying 448G SerDes in AI and HPC cluster networks. In this white paper, you’ll learn: The impact of retimed vs. unretimed host architectures on signal integrity and power Key trade-offs between PAM4 and PAM6 modulation Channel design simulations and DSP implications using real-world 448G topologies Equalization stra... » read more

SRAM PUF: A Revolutionary Approach to Cryptographic Key Protection


Cryptographic keys are the cornerstone of secure digital systems, enabling encryption, authentication, and data integrity. However, securely storing these keys on-chip presents significant challenges. Traditional methods, such as storing keys in one-time programmable, non-volatile memory, are vulnerable to physical attacks, environmental variations, and lifecycle management issues. Physical Unc... » read more

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