Author's Latest Posts

Potential of AOS Memories As A High-Performance SRAM Substitute (Georgia Tech, U. of Virginia)
By Technical Paper Link - 21 Mar, 2025 - Comments: 0

A new technical paper titled "Optimization and Benchmarking of Monolithically Stackable Gain Cell Memory for Last-Level Cache" was published by researchers at Georgia Institute of Technology and University of Virginia. Abstract: "The Last Level Cache (LLC) is the processor's critical bridge between on-chip and off-chip memory levels - optimized for high density, high bandwidth, and low oper... » read more

EFO Errors In The Wire-Bonding Semiconductor Packaging Process
By Technical Paper Link - 19 Mar, 2025 - Comments: 0

A new technical paper titled "A Comparative Study on Various Au Wire Rinse Compositions and Their Effects on the Electronic Flame-Off Errors of Wire-Bonding Semiconductor Package" was published by researchers at Hanbat National University, Seoul National University and Chungnam National University. The paper states: "In this study, we identify the origin of electronic flame-off (EFO) erro... » read more

Design Optimization Techniques To Improve NC-CFET Performance
By Technical Paper Link - 14 Mar, 2025 - Comments: 0

A new technical paper titled "Insights Into Design Optimization of Negative Capacitance Complementary-FET (CFET)" was published by researchers at National Yang Ming Chiao Tung University. Abstract "This work assesses and analyzes negative-capacitance CFETs (NC-CFETs) with metal-ferroelectric-insulator-semiconductor (MFIS) and metal-ferroelectric-metal-insulator-semiconductor (MFMIS) configu... » read more

Energy-Efficient Scalable Silicon Photonic Platform For AI Accelerator HW
By Technical Paper Link - 12 Mar, 2025 - Comments: 0

A new technical paper titled "Large-Scale Integrated Photonic Device Platform for Energy-Efficient AI/ML Accelerators" was published by researchers at HP Labs, IIT Madras, Microsoft Research and University of Michigan. Abstract "The convergence of deep learning and Big Data has spurred significant interest in developing novel hardware that can run large artificial intelligence (AI) workload... » read more

Review Of Recent Advancements in THz-based 6G: Devices, Circuits, Antennas and Packaging
By Technical Paper Link - 12 Mar, 2025 - Comments: 0

A new technical paper titled "A Survey on Advancements in THz Technology for 6G: Systems, Circuits, Antennas, and Experiments" was published by UCLA. Abstract "Terahertz (THz) carrier frequencies (100 GHz to 10 THz) have been touted as a source for unprecedented wireless connectivity and high-precision sensing, courtesy of their wide bandwidth availability and small wavelengths. However, no... » read more

Multi-Party Computation for Securing Chiplets
By Technical Paper Link - 12 Mar, 2025 - Comments: 0

A new technical paper titled "Garblet: Multi-party Computation for Protecting Chiplet-based Systems" was published by Worcester Polytechnic Institute. Abstract "The introduction of shared computation architectures assembled from heterogeneous chiplets introduces new security threats. Due to the shared logical and physical resources, an untrusted chiplet can act maliciously to surreptitiousl... » read more

A Novel Tier Partitioning Method in 3DIC Placement Optimizing PPA
By Technical Paper Link - 11 Mar, 2025 - Comments: 0

A new technical paper titled "PPA-Aware Tier Partitioning for 3D IC Placement with ILP Formulation" was published by researchers at Seoul National University and Ulsan National Institute of Science and Technology. Abstract "3D ICs are renowned for their potential to enable high-performance and low-power designs by utilizing denser and shorter inter-tier connections. In the physical design f... » read more

Thermal-Aware DSE Framework for 3DICs, With Advanced Cooling Models
By Technical Paper Link - 11 Mar, 2025 - Comments: 0

A new technical paper titled "Cool-3D: An End-to-End Thermal-Aware Framework for Early-Phase Design Space Exploration of Microfluidic-Cooled 3DICs" was published by researchers at University of Michigan, Shanghai Jiao Tong University and University of Virginia. Abstract "The rapid advancement of three-dimensional integrated circuits (3DICs) has heightened the need for early-phase design spa... » read more

Thermally Aware Chiplet Placement Algorithm Based on Automatic Differentiation (MIT, IBM)
By Technical Paper Link - 07 Mar, 2025 - Comments: 0

A new technical paper titled "DiffChip: Thermally Aware Chip Placement with Automatic Differentiation" was published by researchers at MIT and IBM. Abstract "Chiplets are modular integrated circuits that can be combined to form a larger system, offering flexibility and performance enhancements. However, their dense packing often leads to significant thermal management challenges, requiring ... » read more

4D mmWave Radar-Based Road Boundary Detection System
By Technical Paper Link - 07 Mar, 2025 - Comments: 0

A new technical paper titled "Road Boundary Detection Using 4D mmWave Radar for Autonomous Driving" was published by Stanford University. Abstract "Detecting road boundaries, the static physical edges of the available driving area, is important for safe navigation and effective path planning in autonomous driving and advanced driver-assistance systems (ADAS). Traditionally, road boundary de... » read more

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