Author's Latest Posts

Towards Base-Station-On-Chip: Wireless Communication Kernels On A RISC-V Vector Processor (TU Dresden, CeTI)
By Technical Paper Link - 10 Jun, 2025 - Comments: 0

A new technical paper titled "Towards a Base-Station-on-Chip: RISC-V Hardware Acceleration for wireless communication" was published by researchers at TU Dresden and Centre for Tactile Internet with Human-in-the-Loop (CeTI). Abstract "The evolution of 5G and the emergence of 6G wireless communication systems impose higher demands for computing capabilities and lower power consumption in the... » read more

Evaluation of LLMs on HDL-Based Communication Protocol Generation (U. of Illinois Urbana, CISPA)
By Technical Paper Link - 10 Jun, 2025 - Comments: 0

A new technical paper titled "ProtocolLLM: RTL Benchmark for SystemVerilog Generation of Communication Protocols" was published by researchers at University of Illinois Urbana Champaign and CISPA Helmholtz Center for Information Security. Abstract "Recent advances in Large Language Models (LLMs) have shown promising capabilities in generating code for general-purpose programming languages. ... » read more

Metrics And Methodology for Hardware Security Constructs (NIST)
By Technical Paper Link - 09 Jun, 2025 - Comments: 0

A new technical paper titled "Metrics and Methodology for Hardware Security Constructs" was published by NIST. Abstract "Although hardware is commonly believed to be security-resilient, it is often susceptible to vulnerabilities arising from design and implementation flaws. These flaws have the potential to jeopardize not only the hardware's security, but also its operations and critical us... » read more

PCM-Based IMC Technology: Overview Of Materials, Device Physics, Design and Fabrication (IBM Research-Europe)
By Technical Paper Link - 09 Jun, 2025 - Comments: 0

A new technical paper titled "Phase-Change Memory for In-Memory Computing" was published by researchers at IBM Research-Europe. "We review the current state of phase-change materials, PCM device physics, and the design and fabrication of PCM-based IMC chips. We also provide an overview of the application landscape and offer insights into future developments," states the paper. Find the te... » read more

Vertically Stacked ZnO/Te CFETs (POSTECH, Mokpo)
By Technical Paper Link - 09 Jun, 2025 - Comments: 0

A new technical paper titled "Demonstration of Vertically Stacked ZnO/Te Complementary Field-Effect Transistor" was published by researchers at POSTECH and Mokpo National University. Abstract "The complementary field-effect transistor (CFET) structure is a highly area-efficient technology. However, their fabrication entails highly complex integration processes using wafer transfer or recr... » read more

Open-Source RISC-V Cores: Analysis Of Scalar and Superscalar Architectures And Out-Of-Order Machines
By Technical Paper Link - 05 Jun, 2025 - Comments: 0

A new technical paper titled "Ramping Up Open-Source RISC-V Cores: Assessing the Energy Efficiency of Superscalar, Out-of-Order Execution" was published by researchers at ETH Zurich, Università di Bologna and Univ. Grenoble Alpes, Inria. Abstract "Open-source RISC-V cores are increasingly demanded in domains like automotive and space, where achieving high instructions per cycle (IPC) throu... » read more

Determinants Of Bond Wave Speed In Wafer Bonding (Yokohama, TEL)
By Technical Paper Link - 05 Jun, 2025 - Comments: 0

A recent technical paper titled "Factors determining bond wave speed in wafer bonding" was published by researcher at Yokohama National University, Tokyo Electron Kyushu Limited and ANVOS Analytics. Abstract "Wafer-level direct bonding has become a critical process for advanced 3D architectures in logic, memory, and CMOS image sensors. The minimization of the wafer distortion caused by wafe... » read more

Hardware-Oriented Analysis of Multi-Head Latent Attention (MLA) in DeepSeek-V3 (KU Leuven)
By Technical Paper Link - 04 Jun, 2025 - Comments: 0

A new technical paper titled "Hardware-Centric Analysis of DeepSeek's Multi-Head Latent Attention" was published by researchers at KU Leuven. Abstract "Multi-Head Latent Attention (MLA), introduced in DeepSeek-V2, improves the efficiency of large language models by projecting query, key, and value tensors into a compact latent space. This architectural change reduces the KV-cache size and s... » read more

Integration of High-Density Polymer Waveguides With Silicon Photonics for CPO (imec, Ghent)
By Technical Paper Link - 03 Jun, 2025 - Comments: 0

A technical paper titled "Low-Loss Integration of High-Density Polymer Waveguides with Silicon Photonics for Co-Packaged Optics" was published by researchers at imec and Ghent University. Abstract "Co-Packaged Optics applications require scalable and high-yield optical interfacing solutions to silicon photonic chiplets, offering low-loss, broadband, and polarization-independent optical coup... » read more

V-NAND PUFs (Seoul National University, SK hynix)
By Technical Paper Link - 03 Jun, 2025 - Comments: 0

A new technical paper titled "Concealable physical unclonable functions using vertical NAND flash memory" was published by researchers at Seoul National University and SK hynix. The paper proposes "a concealable PUF using V-NAND flash memory by generating PUF data through weak Gate-Induced-Drain-Leakage (GIDL) erase." Find the technical paper here. June 2025. Park, SH., Koo, RH., Yang,... » read more

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