Author's Latest Posts

Plasma Etching : Challenges And Options Going Forward (UMD, IBM, Lam Research, Intel, Samsung et al.)
By Technical Paper Link - 18 Jun, 2024 - Comments: 0

A new technical paper titled "Future of plasma etching for microelectronics: Challenges and opportunities" was published by researchers from numerous academic institutions and companies, including University of Maryland, IBM, Arkema, UCLA, Lam Research, Intel Corporation, Samsung, Air Liquide, Sony, and many others. Abstract: "Plasma etching is an essential semiconductor manufacturing techn... » read more

Rowhammer Bit Flips On A High-End RISC-V CPU (ETH Zurich)
By Technical Paper Link - 13 Jun, 2024 - Comments: 0

A new technical paper titled "RISC-H: Rowhammer Attacks on RISC-V" was published by researchers at ETH Zurich.  RISC-H will be presented at DRAMSec (co-located with ISCA 2024) Abstract: "The first high-end RISC-V CPU with DDR4 support has been released just a few months ago. There are currently no Rowhammer studies on RISC-V devices and it is unclear whether it is possible to compromise ... » read more

KAN: Kolmogorov Arnold Networks: An Alternative To MLPs (MIT, CalTech, et al.)
By Technical Paper Link - 13 Jun, 2024 - Comments: 0

A new technical paper titled "KAN: Kolmogorov-Arnold Networks" was published by researchers at MIT, CalTech, Northeastern University and The NSF Institute for Artificial Intelligence and Fundamental Interactions. Abstract: "Inspired by the Kolmogorov-Arnold representation theorem, we propose Kolmogorov-Arnold Networks (KANs) as promising alternatives to Multi-Layer Perceptrons (MLPs). While... » read more

Probing Attacks Against Chiplets
By Technical Paper Link - 11 Jun, 2024 - Comments: 0

A technical paper titled “Evaluating Vulnerability of Chiplet-Based Systems to Contactless Probing Techniques” was published by researchers at University of Massachusetts and Worcester Polytechnic Institute. Abstract: "Driven by a need for ever increasing chip performance and inclusion of innovative features, a growing number of semiconductor companies are opting for all-inclusive System-... » read more

Characterizing and Evaluating A Quantum Processor Unit In A HPC Center
By Technical Paper Link - 10 Jun, 2024 - Comments: 0

A new technical paper titled "Calibration and Performance Evaluation of a Superconducting Quantum Processor in an HPC Center" was published by researchers at Leibniz Supercomputing Centre, IQM Quantum Computers, and Technical University of Munich. Abstract "As quantum computers mature, they migrate from laboratory environments to HPC centers. This movement enables large-scale deployments,... » read more

Device Characteristics of GAA-Structured CMOS and CTFET Under Varying Temperatures
By Technical Paper Link - 10 Jun, 2024 - Comments: 0

A new technical paper titled "Vertical-Stack Nanowire Structure of MOS Inverter and TFET Inverter in Low-temperature Application" was published by researchers at National Tsing Hua University and National United University in Taiwan. Abstract "Tunneling field effect transistors (TFET) have emerged as promising candidates for integrated circuits beyond conventional metal oxide semiconductor ... » read more

Efficient TNN Inference on RISC-V Processing Cores With Minimal HW Overhead
By Technical Paper Link - 10 Jun, 2024 - Comments: 0

A new technical paper titled "xTern: Energy-Efficient Ternary Neural Network Inference on RISC-V-Based Edge Systems" was published by researchers at ETH Zurich and Universita di Bologna. Abstract "Ternary neural networks (TNNs) offer a superior accuracy-energy trade-off compared to binary neural networks. However, until now, they have required specialized accelerators to realize their effic... » read more

Adoption of Chiplet Technology in the Automotive Industry
By Technical Paper Link - 10 Jun, 2024 - Comments: 0

A technical paper titled "Chiplets on Wheels: Review Paper on Holistic Chiplet Solutions for Autonomous Vehicles" was published by researchers at the Indian Institute of Technology, Madras. Abstract "On the advent of the slow death of Moore's law, the silicon industry is moving towards a new era of chiplets. The automotive industry is experiencing a profound transformation towards software-... » read more

Comparing Thermal Properties In Molybdenum Substrate To Si And Glass For A System-On-Foil Integration (RIT, Lux)
By Technical Paper Link - 31 May, 2024 - Comments: 0

A technical paper titled “Comparative Analysis of Thermal Properties in Molybdenum Substrate to Silicon and Glass for a System-on-Foil Integration” was published by researchers at Rochester Institute of Technology and Lux Semiconductors. Abstract: "Advanced electronics technology is moving towards smaller footprints and higher computational power. In order to achieve this, advanced packag... » read more

Using Formal Verification To Evaluate The HW Reliability Of A RISC-V Ibex Core In The Presence Of Soft Errors
By Technical Paper Link - 31 May, 2024 - Comments: 0

A technical paper titled “Using Formal Verification to Evaluate Single Event Upsets in a RISC-V Core” was published by researchers at University of Southampton. Abstract: "Reliability has been a major concern in embedded systems. Higher transistor density and lower voltage supply increase the vulnerability of embedded systems to soft errors. A Single Event Upset (SEU), which is also calle... » read more

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