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Controlling Speckle Contrast Using Existing Lithographic Scanner Knobs to Understand LWR (Samsung, ASML)
By Technical Paper Link - 29 Jan, 2025 - Comments: 0

A new technical paper titled "Controlling Speckle Contrast Using Existing Lithographic Scanner Knobs to Explore the Impact on Line Width Roughness" was published by researchers at Samsung, ASML and Sungkyunkwan University. Abstract "Local critical dimension uniformity (LCDU) or line width roughness (LWR) is increasingly important in argon fluoride (ArF) immersion lithography systems (scanne... » read more

DeepSeek: Improving Language Model Reasoning Capabilities Using Pure Reinforcement Learning
By Technical Paper Link - 27 Jan, 2025 - Comments: 0

A new technical paper titled "DeepSeek-R1: Incentivizing Reasoning Capability in LLMs via Reinforcement Learning" was published by DeepSeek. Abstract: "We introduce our first-generation reasoning models, DeepSeek-R1-Zero and DeepSeek-R1. DeepSeek-R1-Zero, a model trained via large-scale reinforcement learning (RL) without supervised fine-tuning (SFT) as a preliminary step, demonstrates rema... » read more

SRAM With Mixed Signal Logic With Noise Immunity in 3nm Nanosheet (IBM)
By Technical Paper Link - 24 Jan, 2025 - Comments: 0

A new technical paper titled "SRAM and Mixed-Signal Logic With Noise Immunity in 3nm Nano-Sheet Technology" was published by researchers at IBM T. J. Watson Research Center and IBM. Abstract "A modular 4.26Mb SRAM based on a 82Kb/block structure with mixed signal logic is fabricated, characterized, and demonstrated with full functionality in a 3nm nanosheet (NS) technology. Designed macros ... » read more

Electronic and Transport Properties of Six TMD Heterostructures
By Technical Paper Link - 24 Jan, 2025 - Comments: 0

A new technical paper titled "Computational Assessment of I–V Curves and Tunability of 2D Semiconductor van der Waals Heterostructures" was published by researchers at Chalmers University of Technology. Abstract "Two-dimensional (2D) transition metal dichalcogenides (TMDs) have received significant interest for use in tunnel field-effect transistors (TFETs) due to their ultrathin layers... » read more

Analog Accelerator For AI/ML Training Workloads Using Stochastic Gradient Descent (Imperial College London)
By Technical Paper Link - 24 Jan, 2025 - Comments: 0

A new technical paper titled "Learning in Log-Domain: Subthreshold Analog AI Accelerator Based on Stochastic Gradient Descent" was published by researchers at Imperial College London. Abstract "The rapid proliferation of AI models, coupled with growing demand for edge deployment, necessitates the development of AI hardware that is both high-performance and energy-efficient. In this paper, w... » read more

Reverse Engineering Approach for Evaluating HW IP Protection ( U. of Florida, Indiana U.)
By Technical Paper Link - 23 Jan, 2025 - Comments: 0

A technical paper titled "Library-Attack: Reverse Engineering Approach for Evaluating Hardware IP Protection" was published by researchers at University of Florida and Indiana University. Abstract "Existing countermeasures for hardware IP protection, such as obfuscation, camouflaging, and redaction, aim to defend against confidentiality and integrity attacks. However, within the current thr... » read more

New Class Of Memory: Managed-Retention Memory or MRM (Microsoft Research)
By Technical Paper Link - 22 Jan, 2025 - Comments: 0

A new technical paper titled "Managed-Retention Memory: A New Class of Memory for the AI Era" was published by researchers at Microsoft. Abstract "AI clusters today are one of the major uses of High Bandwidth Memory (HBM). However, HBM is suboptimal for AI workloads for several reasons. Analysis shows HBM is overprovisioned on write performance, but underprovisioned on density and read band... » read more

Parallelized Compilation Pipeline Optimized for Chiplet-Based Quantum Computers
By Technical Paper Link - 21 Jan, 2025 - Comments: 0

A new technical paper titled "Modular Compilation for Quantum Chiplet Architectures" was published by researchers at Northwestern University. Abstract "As quantum computing technology continues to mature, industry is adopting modular quantum architectures to keep quantum scaling on the projected path and meet performance targets. However, the complexity of chiplet-based quantum devices, cou... » read more

3D Integration And Test Results From TSV-Processed Chips (CERN et al.)
By Technical Paper Link - 20 Jan, 2025 - Comments: 0

A new technical paper titled "3D integration of pixel readout chips using Through-Silicon-Vias" was published by researchers at CERN, IZM Fraunhofer and University of Geneva. Abstract "Particle tracking and imaging detectors are becoming increasingly complex, driven by demands for densely integrated functionality and maximal sensitive area. These challenging requirements can be met using 3D... » read more

Impact of Extremely Low Temperatures On The 5nm SRAM Array Size and Performance
By Technical Paper Link - 20 Jan, 2025 - Comments: 0

A new technical paper titled "Novel Trade-offs in 5 nm FinFET SRAM Arrays at Extremely Low Temperatures" was published by researchers at University of Stuttgart, IIT Kanpur, National Yang Ming Chiao Tung University, Khalifa University, and TU Munich. Abstract "Complementary metal–oxide–semiconductor (CMOS)-based computing promises drastic improvement in performance at extremely low temp... » read more

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