Author's Latest Posts

Patterning Doping On Very Large Monolayer MoS2 (NREL)
By Technical Paper Link - 03 Dec, 2024 - Comments: 0

A new technical paper titled "Spatially Precise Light-Activated Dedoping in Wafer-Scale MoS2 Films" was published by researchers at National Renewable Energy Laboratory (NREL) and Renewable & Sustainable Energy Institute (RASEI). "In this work, we unravel the mechanism that drives PL* changes of MoS2 monolayers under laser illumination in ambient conditions. We demonstrate the critical ... » read more

The Vulnerability of Clock Trees to Asymmetric Aging
By Technical Paper Link - 03 Dec, 2024 - Comments: 0

A new technical paper titled "The Impact of Asymmetric Transistor Aging on Clock Tree Design Considerations" was published by researchers at Israel Institute of Technology and The Hebrew University of Jerusalem. Abstract "Ensuring integrated circuits (ICs) operate reliably throughout their expected service life is more vital than ever, particularly as they become increasingly central to mis... » read more

Chiplet-Based NPUs to Accelerate Vehicular AI Perception Workloads
By Technical Paper Link - 02 Dec, 2024 - Comments: 0

A new technical paper titled "Performance Implications of Multi-Chiplet Neural Processing Units on Autonomous Driving Perception" was published by researchers at UC Irvine. Abstract "We study the application of emerging chiplet-based Neural Processing Units to accelerate vehicular AI perception workloads in constrained automotive settings. The motivation stems from how chiplets technology i... » read more

STCO for Dense Edge Architectures using 3D Integration and NVM (imec,, et al.)
By Technical Paper Link - 27 Nov, 2024 - Comments: 0

A new technical paper titled "System-Technology Co-Optimization for Dense Edge Architectures using 3D Integration and Non-Volatile Memory" was published by researchers at imec, INESC-ID, Université Libre de Bruxelles, et al. "In this paper, we present an system-technology co-optimization (STCO) framework that interfaces with workload-driven system scaling challenges and physical design-enab... » read more

Gate-All-Around: TCAD and DTCO Approach To Evaluate Power and Performance (imec, et al.)
By Technical Paper Link - 27 Nov, 2024 - Comments: 0

A new technical paper titled "Exploring GAA-Nanosheet, Forksheet and GAA-Forksheet Architectures: a TCAD-DTCO Study at 90 nm & 120 nm Cell Height" was published by imec, Huawei Technologies and Global TCAD Solutions. Abstract "This study presents a Technology Computer Aided Design (TCAD) and comprehensive Design-Technology Co-Optimization (DTCO) approach to evaluate and enhance power an... » read more

Critical Design Considerations For High-Bandwidth Chiplet Interconnects (TSMC)
By Technical Paper Link - 26 Nov, 2024 - Comments: 0

A new technical paper titled "High-Bandwidth Chiplet Interconnects for Advanced Packaging Technologies in AI/ML Applications: Challenges and Solutions" was published by researchers at TSMC. Abstract: "The demand for chiplet integration using 2.5D and 3D advanced packaging technologies has surged, driven by the exponential growth in computing performance required by Artificial Intelligence a... » read more

Pooling CPU Memory for LLM Inference With Lower Latency and Higher Throughput (UC Berkeley)
By Technical Paper Link - 26 Nov, 2024 - Comments: 0

A new technical paper titled "Pie: Pooling CPU Memory for LLM Inference" was published by researchers at UC Berkeley. Abstract "The rapid growth of LLMs has revolutionized natural language processing and AI analysis, but their increasing size and memory demands present significant challenges. A common solution is to spill over to CPU memory; however, traditional GPU-CPU memory swapping ofte... » read more

Monitor Etch Defects on Dies in the Outer Regions Of The Wafer Using ISR
By Technical Paper Link - 26 Nov, 2024 - Comments: 0

A technical paper titled "Detection of defective chips from nanostructures with a high-aspect ratio using hyperspectral imaging and deep learning" was published by researchers at Samsung Electronics. Abstract: "We have developed an imaging spectroscopic reflectometry (ISR) method based on hyperspectral imaging and deep learning to detect defects in the bottom region of high-aspect-ratio nan... » read more

Backpropagation Algorithm On Neuromorphic Spiking HW (U. Of Zurich, ETH Zurich, LANL)
By Technical Paper Link - 25 Nov, 2024 - Comments: 0

A new technical paper titled "The backpropagation algorithm implemented on spiking neuromorphic hardware" was published by University of Zurich, ETH Zurich, Los Alamos National Laboratory, Royal Institution, London, et al. "This study presents a neuromorphic, spiking backpropagation algorithm based on synfire-gated dynamical information coordination and processing implemented on Intel’s Lo... » read more

Direct-To-Chip Liquid-Cooled Data Centers (Binghamton, Nvidia)
By Technical Paper Link - 22 Nov, 2024 - Comments: 0

A new technical paper titled "Parameters of performance: A deep dive into liquid-to-air CDU assessment" was published by researchers at Binghamton University-SUNY and NVIDIA. Abstract: "The rapid growth in data center workloads and the increasing complexity of modern applications have led to significant contradictions between computational performance and thermal management. Traditional air... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2025 SMG   |  Terms of Service  |  Privacy Policy