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3-Channel Package-Scale Galvanic Isolation Interface for SiC and GaN Power Switching Converters
By Technical Paper Link - 09 Apr, 2024 - Comments: 0

A new technical paper titled "A Three-Channel Package-Scale Galvanic Isolation Interface for Wide Bandgap Gate Drivers" was published by STMicroelectronics and DIEEI, Università di Catania. Abstract "This article presents the design of a three-channel package-scale galvanic isolation interface for SiC and GaN power switching converters. The isolation interface consists of two side-by-sid... » read more

2D van der Waals Magnets Above Room Temperature (MIT)
By Technical Paper Link - 09 Apr, 2024 - Comments: 0

A new technical paper titled "Field-free deterministic switching of all–van der Waals spin-orbit torque system above room temperature" was published by researchers at MIT, with funding by the NSF and U.S. Department of Energy. Abstract "Two-dimensional van der Waals (vdW) magnetic materials hold promise for the development of high-density, energy-efficient spintronic devices for memory an... » read more

Low-Overhead Fault-Tolerant Quantum Memory (IBM)
By Technical Paper Link - 07 Apr, 2024 - Comments: 0

A new technical paper titled "High-threshold and low-overhead fault-tolerant quantum memory" was published by researchers at IBM Quantum. Abstract "The accumulation of physical errors prevents the execution of large-scale algorithms in current quantum computers. Quantum error correction promises a solution by encoding k logical qubits onto a larger number n of physical qubits, such t... » read more

Scalable Verification of Memory Consistency (Purdue University)
By Technical Paper Link - 06 Apr, 2024 - Comments: 0

A new technical paper titled "QED: Scalable Verification of Hardware Memory Consistency" was published by researchers at Purdue University. Abstract "Memory consistency model (MCM) issues in out-of-order-issue microprocessor-based shared-memory systems are notoriously non-intuitive and a source of hardware design bugs. Prior hardware verification work is limited to in-order-issue processors... » read more

Rowhammer Exploitation On AMD Platforms, DDR4 DDR5 (ETH Zurich)
By Technical Paper Link - 03 Apr, 2024 - Comments: 0

A new technical paper titled "ZenHammer: Rowhammer Attacks on AMD Zen-based Platforms" was published by researchers at ETH Zurich. The work will be presented at USENIX Security Symposium in August 2024. Abstract: "AMD has gained a significant market share in recent years with the introduction of the Zen microarchitecture. While there are many recent Rowhammer attacks launched from Intel CPU... » read more

Power Sub-Mesh Construction To Mitigate IR Drop And Minimize Routing Overhead (Intel)
By Technical Paper Link - 02 Apr, 2024 - Comments: 0

A new technical paper titled "Power Sub-Mesh Construction in Multiple Power Domain Design with IR Drop and Routability Optimization" was published by researchers at Intel Corporation and National Taiwan University. Abstract: "Multiple power domain design is prevalent for achieving aggressive power savings. In such design, power delivery to cross-domain cells poses a tough challenge at adv... » read more

Hybrid All-Optical Switching Devices Combining Silicon Nanocavities And 2D Semiconductor Material
By Technical Paper Link - 02 Apr, 2024 - Comments: 0

A new technical paper titled "Hybrid silicon all-optical switching devices integrated with two-dimensional material" was published by researchers at RIKEN, National Institute of Advanced Industrial Science and Technology (AIST), and Keio University. Abstract "We propose and demonstrate hybrid all-optical switching devices that combine silicon nanocavities and two-dimensional semiconduct... » read more

High-Temp, High-Electron Mobility MOSFETs Based On N-Type Diamond
By Technical Paper Link - 02 Apr, 2024 - Comments: 0

A new technical paper titled "High-Temperature and High-Electron Mobility Metal-Oxide-Semiconductor Field-Effect Transistors Based on N-Type Diamond" was published by researchers at National Institute for Materials Science (Japan). Abstract: "Diamond holds the highest figure-of-merits among all the known semiconductors for next-generation electronic devices far beyond the performance of c... » read more

Electrically Controlled All-AFM Tunnel Junctions on Silicon with Large Room-Temperature Magnetoresistance (Northwestern)
By Technical Paper Link - 02 Apr, 2024 - Comments: 0

A new technical paper titled "Electrically Controlled All-Antiferromagnetic Tunnel Junctions on Silicon with Large Room-Temperature Magnetoresistance" was published by researchers at Northwestern University, Universitat Jaume, California State University Northridge, Argonne National Lab, Politecnico diBari, and University of Messina. Abstract "Antiferromagnetic (AFM) materials are a pathway... » read more

New Memory Architecture For Local Differential Privacy in Hardware
By Technical Paper Link - 02 Apr, 2024 - Comments: 0

A technical paper titled "Two Birds with One Stone: Differential Privacy by Low-power SRAM Memory" was published by researchers at North Carolina State University, University of South Alabama, and University of Tennessee. Abstract "The software-based implementation of differential privacy mechanisms has been shown to be neither friendly for lightweight devices nor secure against side-channe... » read more

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