Author's Latest Posts

ANN Framework for Thermal-Aware Modeling of GAAFETs (NYCU)
By Technical Paper Link - 12 May, 2026 - Comments: 0

A new technical paper, "A Device-Physics-Informed Artificial Neural Network Approach for Thermal-Aware I-V and C-V Modeling of GAA FETs," was published by researchers at National Yang Ming Chiao Tung University. Abstract "This work introduces a device-physics-informed neural network framework for simultaneous modeling of thermal-aware I-V and C-V characteristics of gate-all-around (GAA) f... » read more

Silicon Photonics: Integrated Grating-Based Antennas for Optical Phased Arrays (MIT)
By Technical Paper Link - 12 May, 2026 - Comments: 0

A new technical paper, "Reduced-crosstalk antennas for grating-lobe-free and wide-field-of-view integrated optical phased arrays," was published by researchers at MIT. Abstract "Integrated optical phased arrays (OPAs) have emerged as a promising technology for many applications due to their ability to dynamically control free-space optical beams in a compact and non-mechanical manner. How... » read more

HW-Based Image Generation Using FTJs (SNU, Sungkyunkwan U., SK hynix et al.)
By Technical Paper Link - 12 May, 2026 - Comments: 0

A new technical paper, "CMOS-compatible ferroelectric tunnel junctions integrate stochastic sampling and deterministic computing for image generation," was published by researchers at Seoul National University, Sungkyunkwan University, Hanyang University, Sogang University, and SK Hynix. Abstract "Recent progress in generative modeling has intensified the need for compact, energy-efficien... » read more

Supporting Safety Requirements from RTL Exploration Through Implementation in Semiconductor Devices (Politecnico di Torino, Synopsys)
By Technical Paper Link - 12 May, 2026 - Comments: 0

A new technical paper, "Early Functional Safety and PPA evaluation for faster digital design development," was published by researchers at Politecnico di Torino and Synopsys. Abstract "The use of semiconductor devices in safety-critical applications is increasing in both volume and complexity. Applications in markets such as automotive, data centers, and aerospace have dependability requi... » read more

High-NA EU Lithography: Extending The STCC Formula (Science Tokyo)
By Technical Paper Link - 06 May, 2026 - Comments: 0

A new technical paper, "Source-position-dependent transmission cross coefficient formula including polarization and mask three-dimensional effects in high-numerical-aperture extreme ultraviolet lithography" was published by researchers at Institute of Science Tokyo. This work is based on the paper presented at SPIE Advanced Lithography + Patterning 2026. "The polarization effect is not negli... » read more

A Detailed Evaluation of A Production Server With High-End MRDIMM Main Memory (BSC, Micron, Intel, UPC)
By Technical Paper Link - 05 May, 2026 - Comments: 0

A new technical paper, "Performance and Energy Benefits of MRDIMMs," was published by researchers at Barcelona Supercomputing Center, Universitat Politecnica de Catalunya, Micron and Intel Corporation. Abstract "Multiplexed Rank DIMMs (MRDIMMs) have recently emerged as memory devices that enable higher bandwidth without increasing DRAM chip frequencies. This paper presents a detailed perf... » read more

GPU Power Prediction Tool for AI Workloads (MIT, IBM)
By Technical Paper Link - 05 May, 2026 - Comments: 0

A new technical paper, "EnergAIzer: Fast and Accurate GPU Power Estimation Framework for AI Workloads," was published by researchers at MIT and IBM Research. Abstract "As AI workloads drive increases in datacenter power consumption, accurate GPU power estimation is critical for proactive power management. However, existing power models face a scalability bottleneck not in the modeling tec... » read more

Pre-Silicon Verification and Validation Methodology Targeting Robust RISC-V Chip Designs (BSC)
By Technical Paper Link - 05 May, 2026 - Comments: 0

A new technical paper, "Verification and Validation (V&V)-in-the-Loop for RISC-V Design: The Holistic Vision of BZL," was published by researchers at Barcelona Supercomputing Center. Abstract "The Barcelona Zetascale Lab (BZL) project aims to strengthening Europe's capacity in the design and manufacture of RISC-V based high-performance computing chips. In this context, we present a ho... » read more

Foundry-Compatible Grating Couplers Using an Inverse Design Framework (Yale)
By Technical Paper Link - 05 May, 2026 - Comments: 0

A new technical paper, "Multimode grating couplers via foundry-compliant inverse design," was published by researchers at Yale University. Abstract "We apply a systematic inverse design approach to discover foundry-compliant, multilayer grating couplers that can efficiently couple a number of independent waves from free space to on-chip propagating modes. For visible- and near-infrared co... » read more

SDVs: Modular Drive Architecture Using Power-Packet-Based Sensorless Control (Kyoto U.)
By Technical Paper Link - 05 May, 2026 - Comments: 0

A new technical paper, "Modular Drive Architecture for Software-defined Vehicles Enabled by Power-packet-based Sensorless Control," was published by researchers at Kyoto University. Abstract "The transition toward software-defined vehicles requires standardization and modularization of hardware decoupled from software, along with centralized electrical/electronic architectures. While elec... » read more

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