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Environmental Impact of Semiconductor Manufacturing (ORNL)
By Technical Paper Link - 15 Mar, 2024 - Comments: 0

A  technical paper titled "Cleaner Chips: Decarbonization in Semiconductor Manufacturing" was published by researchers at Oak Ridge National Laboratory (ORNL) / UT-Battelle. Abstract: "The growth of the information and communication technology sector has vastly accelerated in recent decades because of advancements in digitalization and Artificial Intelligence (AI). Scope 1, 2, and 3 gree... » read more

DRAM Chip Characterization Study of Spatial Variation of Read Disturbance and Future Solutions (ETH Zurich)
By Technical Paper Link - 15 Mar, 2024 - Comments: 0

A new technical paper titled "Spatial Variation-Aware Read Disturbance Defenses: Experimental Analysis of Real DRAM Chips and Implications on Future Solutions" was published by researchers at ETH Zurich. Abstract: "Read disturbance in modern DRAM chips is a widespread phenomenon and is reliably used for breaking memory isolation, a fundamental building block for building robust systems. Row... » read more

Photonic Compact Chip That Seamlessly Converts Light Into Microwaves (NIST, et al.)
By Technical Paper Link - 15 Mar, 2024 - Comments: 0

A new technical paper titled "Photonic chip-based low-noise microwave oscillator" was published by researchers at NIST, University of Colorado Boulder, California Institute of Technology, UCSB, University of Virginia and Yale University. Abstract "Numerous modern technologies are reliant on the low-phase noise and exquisite timing stability of microwave signals. Substantial progress has b... » read more

LLMs For EDA, HW Design and Security
By Technical Paper Link - 12 Mar, 2024 - Comments: 0

A new technical paper titled "Hardware Phi-1.5B: A Large Language Model Encodes Hardware Domain Specific Knowledge" was published by researchers at Kansas State University, University of Science and Technology of China, Michigan Technological University, Washington University in St. Louis and Silicon Assurance. Abstract "In the rapidly evolving semiconductor industry, where research, design... » read more

Reprogrammable Light-Based Processor (RMIT)
By Technical Paper Link - 12 Mar, 2024 - Comments: 0

A new technical paper titled "Programmable high-dimensional Hamiltonian in a photonic waveguide array" was published by researchers at RMIT University, ETH Zurich, Griffith University, Heriot-Watt University, University of Muenster Purdue University and others. Abstract "Waveguide lattices offer a compact and stable platform for a range of applications, including quantum walks, condensed m... » read more

Distributed Batteries Within a Heterogeneous 3D IC
By Technical Paper Link - 12 Mar, 2024 - Comments: 0

A new technical paper titled "On-Chip Batteries as Distributed Energy Sources in Heterogeneous 2.5D/3D Integrated Circuits" was published by researchers at University of Florida (Gainesville) and Brookhaven National Lab. Abstract "Energy efficiency in digital systems faces challenges due to the constraints imposed by small-scale transistors. Moreover, the growing demand for portable consum... » read more

DRAM Chips Perform Functionally-Complete Boolean Operations (ETH Zurich)
By Technical Paper Link - 12 Mar, 2024 - Comments: 0

A new technical paper titled "Functionally-Complete Boolean Logic in Real DRAM Chips: Experimental Characterization and Analysis" was published by researchers at ETH Zurich. Abstract: "Processing-using-DRAM (PuD) is an emerging paradigm that leverages the analog operational properties of DRAM circuitry to enable massively parallel in-DRAM computation. PuD has the potential to significantly ... » read more

UCIe-3D: SiP Architectures With Advanced 3D Packaging With Shrinking Bump Pitches (Intel)
By Technical Paper Link - 12 Mar, 2024 - Comments: 0

A technical paper titled “High-performance, power-efficient three-dimensional system-in-package designs with universal chiplet interconnect express” was published by researchers at Intel. Abstract: "Universal chiplet interconnect express (UCIe) is an open industry standard interconnect for a chiplet ecosystem in which chiplets from multiple suppliers can be packaged together. The UCIe 1.0... » read more

Suppressing Power Side-Channel Attacks: A HW/SW Design For Resource-Constrained IoT Devices
By Technical Paper Link - 12 Mar, 2024 - Comments: 0

A technical paper titled “Hardware/Software Cooperative Design Against Power Side-Channel Attacks on IoT Devices” was published by researchers at Tokyo Institute of Technology and the University of Electro-Communications. Abstract: "With the growth of Internet of Things (IoT) era, the protection of secret information on IoT devices is becoming increasingly important. For IoT devices, atta... » read more

Resistive Switching Analysis In Titanium Oxide-Based Memristors Including Surface Scanning Thermal Microscopy
By Technical Paper Link - 12 Mar, 2024 - Comments: 0

A technical paper titled “Thermal Compact Modeling and Resistive Switching Analysis in Titanium Oxide-Based Memristors” was published by researchers at Universidad de Granada, Leibniz-Institut für innovative Mikroelektronik, Universidad Politécnicade Madrid, University of Twente, King Abdullah University of Science and Technology (KAUST), and Universitat de Barcelona. Abstract: "Resist... » read more

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