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Energy-Efficient DRAM↔PIM Transfers for PIM Systems (KAIST)
By Technical Paper Link - 18 Sep, 2024 - Comments: 0

A new technical paper titled "PIM-MMU: A Memory Management Unit for Accelerating Data Transfers in Commercial PIM Systems" was published by researchers at KAIST. Abstract "Processing-in-memory (PIM) has emerged as a promising solution for accelerating memory-intensive workloads as they provide high memory bandwidth to the processing units. This approach has drawn attention not only from the... » read more

SIA’s Report On the State of the U.S. Semiconductor Industry
By Technical Paper Link - 18 Sep, 2024 - Comments: 0

The Semiconductor Industry Association released its 2024 State of the U.S. Semiconductor Industry report this week, highlighting opportunities for growth, current and emerging challenges, and relevant metrics.  The report reviews the progress made on implementation of the CHIPS Act and associated manufacturing incentives. Supply chain rebalancing, workforce challenges, geopolitics and globa... » read more

Scalable Fabrication of Graphene FETs on Non-Planar Surfaces (Imperial College London)
By Technical Paper Link - 12 Sep, 2024 - Comments: 0

A new technical paper titled "Fabrication of graphene field effect transistors on complex non-planar surfaces" was published by researchers at Imperial College London. Abstract "Graphene field effect transistors (GFETs) are promising devices for biochemical sensing. Integrating GFETs onto complex non-planar surfaces could uncap their potential in emerging areas of wearable electronics, such... » read more

3D IC Partitioning and Placement Method That Optimizes For Critical Paths (POSTECH)
By Technical Paper Link - 12 Sep, 2024 - Comments: 0

A new technical paper titled "TA3D: Timing-Aware 3D IC Partitioning and Placement by Optimizing the Critical Path" was published by researchers at Pohang University of Science and Technology and Baum Design Systems. Abstract "In the face of challenges posed by semiconductor scaling, 3D integration technology has emerged as a crucial solution to overcome the constraints of traditional 2D I... » read more

Relative Humidity in Conductive Atomic Force Microscopy (KAUST)
By Technical Paper Link - 11 Sep, 2024 - Comments: 0

A new technical paper titled "The Effect of Relative Humidity in Conductive Atomic Force Microscopy" was published by researchers at KAUST. Abstract "Conductive atomic force microscopy (CAFM) analyzes electronic phenomena in materials and devices with nanoscale lateral resolution, and it is widely used by companies, research institutions, and universities. Most data published in the field o... » read more

Block Copolymer and Sub-10nm Line Patterns By Directed Self-Assembly (Tokyo Tech)
By Technical Paper Link - 11 Sep, 2024 - Comments: 0

A technical paper titled "Chemically tailored block copolymers for highly reliable sub-10-nm patterns by directed self-assembly" was published by researchers at Tokyo Institute of Technology and Tokyo Ohka Kogyo Co. Abstract "While block copolymer (BCP) lithography is theoretically capable of printing features smaller than 10 nm, developing practical BCPs for this purpose remains challeng... » read more

Quantum Computing: Google’s Surface Code Technique to Reduce Errors
By Technical Paper Link - 11 Sep, 2024 - Comments: 0

A new technical paper titled "Quantum error correction below the surface code threshold" was published by researchers at Google and other collaborators. Abstract "Quantum error correction provides a path to reach practical quantum computing by combining multiple physical qubits into a logical qubit, where the logical error rate is suppressed exponentially as more qubits are added. However, ... » read more

Steps to Fabricate Nanotips Overhanging From Chip Edge By a Few Micrometers (CNRS, CEA-Leti)
By Technical Paper Link - 10 Sep, 2024 - Comments: 0

A new technical paper titled "Suspended tip overhanging from chip edge for atomic force microscopy with an optomechanical resonator" was published by researchers at Lab. d'Analyse et d'Architecture des Systèmes du CNRS and CEA-LETI. Abstract Raising the mechanical frequency of atomic force microscopy (AFM) probes to increase the measurement bandwidth has been a long-standing expectation in... » read more

Hardware-Side-Channel Leakage Contracts That Account For Glitches and Transitions (TU Graz)
By Technical Paper Link - 10 Sep, 2024 - Comments: 0

A new technical paper titled "Closing the Gap: Leakage Contracts for Processors with Transitions and Glitches" was published by researchers at Graz University of Technology. Abstract "Security verification of masked software implementations of cryptographic algorithms must account for microarchitectural side-effects of CPUs. Leakage contracts were proposed to provide a formal separation bet... » read more

Analog In-Memory Computing: Fast Deep NN Training (IBM Research)
By Technical Paper Link - 10 Sep, 2024 - Comments: 0

A new technical paper titled "Fast and robust analog in-memory deep neural network training" was published by researchers at IBM Research. Abstract "Analog in-memory computing is a promising future technology for efficiently accelerating deep learning networks. While using in-memory computing to accelerate the inference phase has been studied extensively, accelerating the training phase has... » read more

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