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Rapid Prototyping For Emerging Semiconductor Devices
By Technical Paper Link - 03 Jan, 2024 - Comments: 0

A technical paper titled “Generating Predictive Models for Emerging Semiconductor Devices” was published by researchers at TU Darmstadt and NaMLab. Abstract: "Circuit design requires fast and scalable models which are compatible to modern electronic design automation tools. For this task typically analytical compact models are preferred. However, for emerging device concepts with altered ... » read more

Quantum Confinement And Its Effect On The Thermoelectric Performance For Thermal Management
By Technical Paper Link - 03 Jan, 2024 - Comments: 0

A technical paper titled “Enhanced thermoelectric performance via quantum confinement in a metal oxide semiconductor field effect transistor for thermal management” was published by researchers at Sandia National Laboratories and Kansas State University. Abstract: "The performance of thermoelectric devices is gauged by the dimensionless figure of merit ZT. Improving ZT has proven to be a ... » read more

Superconducting Material With Exceptional Tunability
By Technical Paper Link - 03 Jan, 2024 - Comments: 0

A technical paper titled “Strain-switchable field-induced superconductivity” was published by researchers at Massachusetts Institute of Technology (MIT), University of Washington, Argonne National Laboratory, Cornell University, Zhejiang University of Science and Technology, and George Mason University. Abstract: "Field-induced superconductivity is a rare phenomenon where an applied magne... » read more

Environmentally Sustainable FPGAs (Notre Dame, Univ. of Pittsburgh)
By Technical Paper Link - 21 Dec, 2023 - Comments: 0

A new technical paper titled "REFRESH FPGAs: Sustainable FPGA Chiplet Architectures" was published by University of Notre Dame and University of Pittsburgh. Abstract "There is a growing call for greater amounts of increasingly agile computational power for edge and cloud infrastructure to serve the computationally complex needs of ubiquitous computing devices. Thus, an important challenge i... » read more

SystemC-based Power Side-Channel Attacks Against AI Accelerators (Univ. of Lubeck)
By Technical Paper Link - 21 Dec, 2023 - Comments: 0

A new technical paper titled "SystemC Model of Power Side-Channel Attacks Against AI Accelerators: Superstition or not?" was published by researchers at Germany's University of Lubeck. Abstract "As training artificial intelligence (AI) models is a lengthy and hence costly process, leakage of such a model's internal parameters is highly undesirable. In the case of AI accelerators, side-chann... » read more

Mixed SRAM And eDRAM Cell For Area And Energy-Efficient On-Chip AI Memory (Yale Univ.)
By Technical Paper Link - 21 Dec, 2023 - Comments: 0

A new technical paper titled "MCAIMem: a Mixed SRAM and eDRAM Cell for Area and Energy-efficient on-chip AI Memory" was published by researchers at Yale University. Abstract: "AI chips commonly employ SRAM memory as buffers for their reliability and speed, which contribute to high performance. However, SRAM is expensive and demands significant area and energy consumption. Previous studies... » read more

Analog Planar Memristor Device: Developing, Designing, and Manufacturing
By Technical Paper Link - 20 Dec, 2023 - Comments: 0

A new technical paper titled "Analog monolayer SWCNTs-based memristive 2D structure for energy-efficient deep learning in spiking neural networks" was published by researchers at Delft University of Technology and Khalifa University. Abstract: "Advances in materials science and memory devices work in tandem for the evolution of Artificial Intelligence systems. Energy-efficient computation... » read more

Nanoscale Reconfigurable Si Transistors (TU Wien, CNRS, UNC)
By Technical Paper Link - 20 Dec, 2023 - Comments: 0

A new technical paper titled "Nanoscale Reconfigurable Si Transistors: From Wires to Sheets and Unto Multi-Wire Channels" was published by researchers at TU Wien, CNRS, and University of North Carolina at Chapel Hill. Abstract: "In this work, bottom-up Al–Si–Al nanowire (NW) heterostructures are presented, which act as a prototype vehicle toward top-down fabricated nanosheet (NS) and ... » read more

Memory Devices-Based Bayesian Neural Networks For Edge AI
By Technical Paper Link - 20 Dec, 2023 - Comments: 0

A new technical paper titled "Bringing uncertainty quantification to the extreme-edge with memristor-based Bayesian neural networks" was published by researchers at Université Grenoble Alpes, CEA, LETI, and CNRS. Abstract: "Safety-critical sensory applications, like medical diagnosis, demand accurate decisions from limited, noisy data. Bayesian neural networks excel at such tasks, offering... » read more

FeFET Memory Encrypted Inside The Storage Array
By Technical Paper Link - 20 Dec, 2023 - Comments: 0

A new technical paper titled "Embedding security into ferroelectric FET array via in situ memory operation" was published by researchers at Pennsylvania State University, University of Notre Dame, Fraunhofer IPMS, National University of Singapore, and North Dakota State University. Abstract "Non-volatile memories (NVMs) have the potential to reshape next-generation memory systems because of... » read more

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