Author's Latest Posts

EUVL: Extreme Ultraviolet Lithography Research, Development, And Manufacturing (NIST)
By Technical Paper Link - 06 Sep, 2023 - Comments: 0

A special paper titled “Report from the Extreme Ultraviolet (EUV) Lithography Working Group Meeting: Current State, Needs, and Path Forwards” was published by researchers at National Institute of Standards and Technology (NIST). Abstract: "This is the report of a hybrid working group meeting held on April 25, 2023, at the National Institute of Standards and Technology (NIST) in Boulder, C... » read more

Automotive Intrusion Detection Methodologies (TU Denmark)
By Technical Paper Link - 06 Sep, 2023 - Comments: 0

A new technical paper titled "Intrusion Detection in the Automotive Domain: A Comprehensive Review" was published by researchers at DTU Compute Technical University of Denmark Abstract "The automotive domain has realized amazing advancements in communication, connectivity, and automation— and at a breakneck pace. Such advancements come with ample benefits, such as the reduction of traffic... » read more

A Microfluidics Device That Can Perform ANN Computation On Data Stored In DNA
By Technical Paper Link - 06 Sep, 2023 - Comments: 0

A technical paper titled “Neural network execution using nicked DNA and microfluidics” was published by researchers at University of Minnesota Twin-Cities and Rochester Institute of Technology. Abstract: "DNA has been discussed as a potential medium for data storage. Potentially it could be denser, could consume less energy, and could be more durable than conventional storage media such a... » read more

Wafer-Scale CMOS-Integrated GFET Arrays With High Yield And Uniformity Designed For Biosensing Applications
By Technical Paper Link - 06 Sep, 2023 - Comments: 0

A technical paper titled “Wafer-Scale Graphene Field-Effect Transistor Biosensor Arrays with Monolithic CMOS Readout” was published by researchers at VTT Technical Research Centre of Finland and Graphenea Semiconductor SLU. Abstract: "The reliability of analysis is becoming increasingly important as point-of-care diagnostics are transitioning from single-analyte detection toward multiplex... » read more

The Utility Of Shallow Dynamic Circuits For Long-Range Entanglement On Large-Scale Quantum Devices
By Technical Paper Link - 06 Sep, 2023 - Comments: 0

A technical paper titled “Efficient Long-Range Entanglement using Dynamic Circuits” was published by researchers at IBM Research, IBM T.J. Watson Research Center, University of Southern California, MIT-IBM Watson AI Lab, and IBM Quantum. Abstract: "Quantum simulation traditionally relies on unitary dynamics, inherently imposing efficiency constraints on the generation of intricate entangl... » read more

A New Layered Structure With 2D Material That Exhibits A Unique Transfer Of Energy And Charge
By Technical Paper Link - 06 Sep, 2023 - Comments: 0

A technical paper titled “Excitation-Dependent High-Lying Excitonic Exchange via Interlayer Energy Transfer from Lower-to-Higher Bandgap 2D Material” was published by researchers at University of Warsaw, Brookhaven National Laboratory, and National Institute for Materials Science (Japan). Abstract: "High light absorption (∼15%) and strong photoluminescence (PL) emission in monolayer (1L... » read more

CXL’s Protection Mechanisms And How They Handle Real-World Security Problems
By Technical Paper Link - 06 Sep, 2023 - Comments: 0

A technical paper titled “How Flexible is CXL's Memory Protection?: Replacing a sledgehammer with a scalpel” was published by researchers at University of Cambridge. Abstract: "CXL, a new interconnect standard for cache-coherent memory sharing, is becoming a reality - but its security leaves something to be desired. Decentralized capabilities are flexible and resilient against malicious a... » read more

An Eco-Friendly Conductive Ink For Thin-Film Electronics
By Technical Paper Link - 06 Sep, 2023 - Comments: 0

A technical paper titled “Recyclable Thin-Film Soft Electronics for Smart Packaging and E-Skins” was published by researchers at Carnegie Mellon University and University of Coimbra. Abstract: Despite advances in soft, sticker-like electronics, few efforts have dealt with the challenge of electronic waste. Here, this is addressed by introducing an eco-friendly conductive ink for thin-film... » read more

An Open-Source Solution To Accelerate Autonomous Vehicle Validation And Verification Research
By Technical Paper Link - 28 Aug, 2023 - Comments: 0

A technical paper titled “PolyVerif: An Open-Source Environment for Autonomous Vehicle Validation and Verification Research Acceleration” was published by researchers at Florida Polytechnic University, Embry-Riddle Aeronautical University, Tallinn University of Technology, and Acclivis Technologies. Abstract: "Validation and Verification (V&V) of Artificial Intelligence (AI) based cyb... » read more

How A Fault-Tolerant Quantum Memory Could Be Realized Using Near-Term Quantum Processors With Small Qubit Overhead
By Technical Paper Link - 28 Aug, 2023 - Comments: 0

A technical paper titled “High-threshold and low-overhead fault-tolerant quantum memory” was published by researchers at IBM T.J. Watson Research Center and MIT-IBM Watson AI Lab. Abstract: "Quantum error correction becomes a practical possibility only if the physical error rate is below a threshold value that depends on a particular quantum code, syndrome measurement circuit, and a decod... » read more

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