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3D-IC: Operator Learning Framework For Ultra-Fast 3D Chip Thermal Prediction Under Multiple Chip Design Configurations
By Technical Paper Link - 24 Mar, 2023 - Comments: 0

A new technical paper titled "DeepOHeat: Operator Learning-based Ultra-fast Thermal Simulation in 3D-IC Design" was published (preprint) by researchers at UCSB and Cadence. Abstract "Thermal issue is a major concern in 3D integrated circuit (IC) design. Thermal optimization of 3D IC often requires massive expensive PDE simulations. Neural network-based thermal prediction models can perform ... » read more

Photonics: GaSb/SiN Tunable Hybrid Integrated Laser
By Technical Paper Link - 24 Mar, 2023 - Comments: 0

A new technical paper titled "Widely tunable 2 µm hybrid laser using GaSb semiconductor optical amplifiers and a Si3N4 photonics integrated reflector" was published by researchers at Tampere University in Finland. Abstract: "Tunable lasers emitting in the 2–3 µm wavelength range that are compatible with photonic integration platforms are of great interest for sensing applications. To ... » read more

Innovations in Device Design of The Gate-All-Around (GAA) Nanosheet FETs (IBM Research)
By Technical Paper Link - 23 Mar, 2023 - Comments: 0

A technical paper titled "A Review of the Gate-All-Around Nanosheet FET Process Opportunities" was published by researchers at IBM Research Albany. Abstract: "In this paper, the innovations in device design of the gate-all-around (GAA) nanosheet FET are reviewed. These innovations span enablement of multiple threshold voltages and bottom dielectric isolation in addition to impact of channel... » read more

Easy-To-Use Mechanical Frequency Comb Platform (TU Delft)
By Technical Paper Link - 23 Mar, 2023 - Comments: 0

A new technical paper titled "Mechanical overtone frequency combs" was published by researchers at Delft University of Technology, Ahmedabad University and NIST. Abstract "Mechanical frequency combs are poised to bring the applications and utility of optical frequency combs into the mechanical domain. So far, their main challenge has been strict requirements on drive frequencies and power,... » read more

Integrating MEMS with Standardized Silicon Photonics Technology
By Technical Paper Link - 23 Mar, 2023 - Comments: 0

A new technical paper titled "Integrated silicon photonic MEMS" was published by researchers at EPFL, University of Sydney, CSEM, KTH Royal Institute of Technology, Ghent University, Imec, and Tyndall National Institute. Abstract Excerpt "Here, we introduce a silicon photonic MEMS platform consisting of high-performance nano-opto-electromechanical devices fully integrated alongside standar... » read more

Feasibility of Using Domain Wall-Magnetic Tunnel Junction for Magnetic Analog Addressable Memories
By Technical Paper Link - 23 Mar, 2023 - Comments: 0

A new technical paper titled "Domain Wall-Magnetic Tunnel Junction Analog Content Addressable Memory Using Current and Projected Data" was published by researchers at UT Austin and Samsung Advanced Institute of Technology (SAIT). Abstract "With the rise in in-memory computing architectures to reduce the compute-memory bottleneck, a new bottleneck is present between analog and digital conver... » read more

New Spintronics Manufacturing Process, Allowing Scaling Down To Sub-5nm (U. of Minnesota/NIST)
By Technical Paper Link - 20 Mar, 2023 - Comments: 0

A new technical paper titled "Sputtered L10-FePd and its Synthetic Antiferromagnet on Si/SiO2 Wafers for Scalable Spintronics" was published by researchers at University of Minnesota and NIST, with funding by DARPA and others. According to a University of Minnesota summary news article, "The industry standard spintronic material, cobalt iron boron, has reached a limit in its scalability. The... » read more

Room-Temperature Metal Bonding Technology That Facilitates The Fabrication of 3D-ICs & 3D Integration With Heterogeneous Devices
By Technical Paper Link - 19 Mar, 2023 - Comments: 0

A technical paper titled "Room-Temperature Direct Cu Semi-Additive Plating (SAP) Bonding for Chip-on-Wafer 3D Heterogenous Integration With μLED" was published by researchers at Tohoku University in Japan. Abstract: "This letter describes a direct Cu bonding technology to there-dimensionally integrate heterogeneous dielets based on a chip-on-wafer configuration. 100- μm -cubed blue μ LED... » read more

Solving The Reliability Problem Of Memristor-Based Artificial Neural Networks
By Technical Paper Link - 19 Mar, 2023 - Comments: 0

A technical paper titled "ReMeCo: Reliable Memristor-Based in-Memory Neuromorphic Computation" was published by researchers at Eindhoven University of Technology, University of Tehran, and USC. Abstract: "Memristor-based in-memory neuromorphic computing systems promise a highly efficient implementation of vector-matrix multiplications, commonly used in artificial neural networks (ANNs). H... » read more

Shift Register-In-Memory Architecture
By Technical Paper Link - 19 Mar, 2023 - Comments: 0

A new technical paper titled "Toward Single-Cell Multiple-Strategy Processing Shift Register Powered by Phase-Change Memory Materials" was published by researchers at Singapore University of Technology and Design and University of Cambridge. Abstract "Modern innovations are built on the foundation of computers. Compared to von Neumann architectures having separate storage and processing uni... » read more

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