Blog Review: Apr. 30

Cadence’s Sree Parvathy points out how electrothermal analysis can help designers understand how temperature changes affect device behavior, such as mobility, threshold voltage, and saturation to mitigate potential failures due to thermal overstress.

In a podcast, Siemens’ Conor Peick, Dale Tutt, and Mike Ellow chat about the transition towards software-defined products and why companies need to embrace a multi-domain approach that integrates software, electronics, and mechanical design to manage the complexity of modern systems-of-systems.

Synopsys’ Jyotika Athavale stresses the importance of automotive functional safety and highlights the role of predictive maintenance techniques, tamper-proof data transfer, and silicon lifecycle management in boosting reliability.

Ansys’ Matt Ladzinski and Caty Fairclough find that the demand for high-speed global connectivity, precise location services, and high-resolution Earth observation is driving the deployment of proliferated low Earth orbit satellite constellations that provide persistent coverage and resilience.

Arm’s Na Li and Koray Ozkal explore the performance benefits of Retrieval-Augmented Generation (RAG), an AI framework for retrieving relevant external knowledge in real-time to enhance the quality of AI-generated text.

Keysight’s Marie Hattar highlights how the megatrends of advanced communication technology, AI, and increased focus on sustainability could drive both industrial and societal shifts.

SEMI’s Jordan Famularo introduces the Circular Semiconductors Research Network, an effort to identify and rank materials used in semiconductor manufacturing to prioritize where conversion from linear to circular use would provide the most gains, with an initial report on 69 distinct materials.

Plus, check out the blogs featured in the latest Manufacturing, Packaging & Materials and Systems & Design newsletters:

Technology Editor Brian Bailey looks at issues stemming from AI software evolving much faster than the hardware, development and verification tools, and power sources.

Lam Research’s Sam Sarkar warns that wafer thinning and TSV formation can introduce mechanical stress and impact device integrity in advanced transistor architectures.

Amkor’s Peater Wu shares results of electrical simulations for determining the impact of temperature on performance.

Synopsys’ Shela Aboud digs into the benefits of GPUs for TCAD, including better speed and capacity for very large designs, enabling design and system technology co-optimization.

D2S’ Aki Fujimura contends that improving mask manufacturing is the simplest way to reduce wafer variation.

ASE’s Thomas Wang shows how to enhance the performance and reliability of power modules through thermal management of sources, interfaces, and resistance.

Arteris’ Andy Nightingale details how NoCs can provide a structured and scalable approach to transporting data between the many IP blocks in a chip.

Synopsys’ Paul Carzola looks at the benefits of automating repetitive regression steps with proactive management to measure efficacy and maximize efficiency.

Siemens’ Jonathan Muirhead explains how to reduce design iterations and improve product quality by moving critical checks earlier in the design cycle.

Cadence’s Geeta Arora shows how to capture a granular view of PCIe link operation using specialized data packets designed to carry debug information.

Keysight’s Roberto Piacentini Filho digs into high-speed digital design challenges, EDA tool capabilities, and software integration benefits.

Axiomise’s Ashish Darbari shows a way to detect and eliminate underutilized components to improve PPA.