Blog Review: Aug. 7

Synopsys’ Jyotika Athavale and Randy Fish investigate the problem of silent data corruption caused by difficult-to-detect hardware defects that cause unnoticed errors in the data being processed and is becoming an increasingly pressing problem as computing scales massively at a rapid pace with the demands of AI.

Siemens’ Keith Felton suggests adopting physical design reuse circuits to provide a more robust and reliable approach to IP reuse for complex IC package designs, enabling dynamic net propagation, rapid ECOs, golden source management, and design modularity.

Cadence’s Jayne Guimaraes checks out Near End Loopback (NELB), a feature introduced by Intel’s PHY Interface spec revision 6.1 that allows the IP to compare transmitted against received data to facilitate testing the PHY device for high-volume manufacturing.

Keysight’s Roberto Piacentini Filho presents a process framework for holistically managing all the stages of system development, bringing together requirements management, IC design stages, implementation stages, verification, testing stages, manufacturing, change management, revision control, and bug tracking.

Arm’s Zenon Xiu introduces some of the instructions that the Arm Scalable Matrix Extension adds, including ones that accumulate or subtract the outer product of two vectors into a ZA tile, add a vector horizontally or vertically to a ZA tile, and add a multiple of the vector size in Streaming SVE mode to a scalar register.

Ansys’ Aliyah Mallak checks out how computational fluid dynamics and cloud computing are used to build a virtual wind tunnel and optimize the aerodynamics of bikes, helmets, and other equipment.

SEMI’s John Cooney listens in as U.S. Under Secretary of State Jose Fernandez explains why forming partnerships is necessary to address vulnerabilities and create stable supply chains for minerals critical to semiconductor manufacturing, like germanium, gallium, arsenic, indium, and rare earth elements.

Plus, check out the blogs featured in the latest Automotive, Security & Pervasive Computing and Test, Measurement & Analytics newsletters:

Siemens’ Lee Wang explains why 3D stacked die for automotive need die-level thermal analysis.

Rambus’ Ajay Kapoor points to the need to secure data even when it’s being used.

Synopsys’ Hezi Saar explains what’s needed for heterogeneous, centralized automotive zonal architectures.

Flex Logix’s Jayson Bethurem looks at cost- and memory-saving techniques to optimize AI performance.

Infineon’s Tammie Bard shows how two small capacitors and a resistor can solve some thorny point-of-load problems.

Renesas’ Jacques Bittar details the impact of new automotive safety features on data.

TXOne’s Darren Chung zeroes in on what defense contractors need to protect against, respond to, and recover from cyber threats.

Cadence’s Reela Samuel lays out the role of CFD in keeping the Olympic Torch lit.

Onto Innovation’s Prasad Bachiraju explains how to turn reactive root cause analytics into proactive monitoring to avoid the advancement of defective die in the pursuit of zero defect manufacturing.

Synopsys’ Faisal Goriawalla digs into HBM4 test challenges and why it’s important to detect defects before system failure.

Teradyne’s Fisher Zhang discusses the auto industry’s push towards smaller process nodes and the challenges that necessitate early and continuous engagement with testing.

Advantest’s Ira Leventhal shows how AI and ML algorithms are used to identify patterns and anomalies that might not be discovered by human testers or traditional methods.