Blog Review: Dec. 18

Siemens’ Michael Munsey predicts that the convergence of AI, advanced packaging, and rise of software-defined products aren’t just incremental changes but will represent a fundamental shift in how we think about semiconductor design and manufacturing.

Cadence’s Veena Parthan points to hex-core voxels as a significant leap forward for the CFD meshing process that blends the best of structured and unstructured methods to offer a superior meshing methodology.

Synopsys’ Jon Ames and Ron Lowman share how emerging standards like Ultra Ethernet and Ultra Accelerator Link (UALink) enable massive AI clusters to be scaled both out via network fabrics and up within the rack.

Ansys’ Eldo N Baby explains how RTL VCDs provide an effective solution to the complex process of selecting the right switching scenario for dynamic voltage drop analysis and details the challenges involved in bringing it into power integrity analysis.

Keysight’s Maggie Lin delves into the challenges of multigigabit automotive Ethernet transmitter testing, which include signal integrity, electromagnetic interference and crosstalk, the complexities of time-sensitive networking, and the harsh physical conditions of the automotive environment.

Arm’s Diya Soubra suggests that the integration of vision into IoT devices can revolutionize how they interact with and perceive the world, unlocking a wide range of new applications and capabilities across many locations.

Imagination’s Eleanor Brash explores key trends driving the integration of edge AI within industrial IoT, from using AR glasses in equipment maintenance operations to autonomous robots and smart grids.

SEMI’s Sungho Yoon looks into patterns in the silicon wafer market, including the role of equipment investments in expanding production capacity and the effect of DRAM price growth trends as two things driving wafer demand.

Plus, check out blogs featured in the latest Automotive, Security & Pervasive Computing, Test, Measurement & Analytics, Low Power-High Performance, and Manufacturing, Packaging & Materials newsletters:

Rambus’ Ajay Kapoor explains why AI accelerators should be able to decrypt data locally when needed.

Cadence’s Neelabh Krishnan points to the benefits of verifying high-speed USB4 functionalities in combination with the sideband channel.

Siemens EDA’s Dina Medhat evaluates ESD protection for interconnect robustness to ensure adequate handling of an event.

Imagination’s Eleanor Brash looks at the technology ecosystem in China and how it is developing successful foundational models and deploying them at the edge.

Synaptics’ Deepak Mital explores the critical elements of a well-designed AI-native edge solution, including intelligent run-time software with tools for model building.

Synopsys’ Dana Neustadter digs into new key encapsulation algorithms and digital signature schemes that are on the horizon.

Infineon’s Advait Kulkarni discusses the benefits of seamless and synchronized transmission of sensor data.

Teradyne’s Jeorge Hurtarte explains how growth in data-rich applications is driving change for the automated test equipment sector.

Advantest’s Ken Butler contends that small improvements in test coverage can result in significantly larger reductions in test escapes.

proteanTecs’ Guy Gozlan shows how machine learning can be applied to wafer sort data and help predict the likelihood a chip will fall into a specific bin during the final test.

PDF Solutions’ John Kibarian explores how the latest tools allow for improved predictions of equipment failures, optimized production schedules, and better yield and profitability.

Bruker Optics’ Antonia Eckert outlines the benefits of simultaneous measurement of multiple gases to identify sources of air pollution.

Synopsys’ Madhumita Sanyal and Aparna Tarde look at efficient ways to connect multiple CPUs and accelerators, switches, and NICs in modern data centers.

Rambus’ Lou Ternullo explains how to dynamically share memory, storage, and accelerators across multiple compute nodes.

Siemens’ Reetika outlines how errors within a reset tree can lead to serious issues, including metastability, glitches, and functional failures.

Fraunhofer IIS/EAS’ Andy Heinig contends that comprehensive testing is needed to ensure that chiplet systems can withstand extreme conditions.

Expedera’s Pat Donnelly shows why it’s essential to process input data from multiple modalities on mobile and embedded devices.

Quadric’s Steve Roddy advises to ensure an NPU vendor is reporting benchmarks in a way that matches your system needs.

Cadence’s Veena Parthan delves into challenges and advancements in interpolation within cell-centered CFD flow solvers.

Ansys’ Laura Carter pinpoints the source of multiple indirect reflections and electromagnetic interference that impair radar function.

Arm’s Ian Bolton offers highlights from the inaugural AI and Games Conference in London, including AI for game development and AI within games.

Amkor’s Siang Miang Yeo explores the benefits of laser ablation, such as reduced chipping, less cracking, and higher throughput.

Synopsys’ Victor Moroz and Shela Aboud look at fine-tuning GAA transistors in terms of performance, Vt engineering, and reliability.

Tignis’ David Park extols the advantages of AI and automation to enhance human potential and take over repetitive tasks, rather than replacing humans.

ASE’s Yin Chang explains why the ability to choose from many different components gives system architects the flexibility to overcome scaling challenges.

SEMI’s Maria Daniela Perez reviews the latest developments discussed at ITF Chip into the Future, hosted by imec at SEMICON Europa 2024.

eBeam Initiative’s Harry Levinson explains why it’s so critical that masks remain defect-free as feature sizes shrink and device densities increase.